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Patent applications and USPTO patent grants for Bernardoni; Lonnie L..The latest application filed is for "low profile mechanical interconnect system having metalized loop and hoop area".
Patent | Date |
---|---|
Low profile mechanical interconnect system having metalized loop and hoop area Grant 5,457,610 - Bernardoni , et al. October 10, 1 | 1995-10-10 |
Method for forming solder deposit on a substrate Grant 5,369,880 - Gundotra , et al. December 6, 1 | 1994-12-06 |
Method and apparatus for partially overmolded integrated circuit package Grant 5,278,726 - Bernardoni , et al. January 11, 1 | 1994-01-11 |
Method of making a transfer molded semiconductor device Grant 5,218,759 - Juskey , et al. June 15, 1 | 1993-06-15 |
Soldering method Grant 5,172,852 - Bernardoni , et al. December 22, 1 | 1992-12-22 |
Electronic component assembly Grant 5,172,303 - Bernardoni , et al. December 15, 1 | 1992-12-15 |
Shielded low-profile electronic component assembly Grant 5,153,379 - Guzuk , et al. October 6, 1 | 1992-10-06 |
Transfer molded semiconductor package with improved adhesion Grant 5,153,385 - Juskey , et al. October 6, 1 | 1992-10-06 |
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