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name:-0.02333402633667
name:-0.014538049697876
name:-0.01797080039978
Berke; Aaron Patent Filings

Berke; Aaron

Patent Applications and Registrations

Patent applications and USPTO patent grants for Berke; Aaron.The latest application filed is for "substrate sticking and breakage mitigation".

Company Profile
14.13.20
  • Berke; Aaron - Portland OR
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Substrate Sticking And Breakage Mitigation
App 20220220627 - Berke; Aaron ;   et al.
2022-07-14
Cross Flow Conduit For Foaming Prevention In High Convection Plating Cells
App 20210395913 - Banik, II; Stephen J. ;   et al.
2021-12-23
Dynamic modulation of cross flow manifold during elecroplating
Grant 11,047,059 - Thorkelsson , et al. June 29, 2
2021-06-29
Methods and apparatus for flow isolation and focusing during electroplating
Grant 11,001,934 - Banik, II , et al. May 11, 2
2021-05-11
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
Grant 10,982,346 - Berke , et al. April 20, 2
2021-04-20
High flow multi-way piston valve for deposition systems
Grant 10,969,036 - Fortner , et al. April 6, 2
2021-04-06
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
Grant 10,923,340 - Kagajwala , et al. February 16, 2
2021-02-16
Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating
Grant 10,781,527 - Banik, II , et al. Sept
2020-09-22
Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation Plating
App 20200232114 - Berke; Aaron ;   et al.
2020-07-23
Flow assisted dynamic seal for high-convection, continuous-rotation plating
Grant 10,612,151 - Berke , et al.
2020-04-07
High Flow Multi-way Piston Valve For Deposition Systems
App 20190368630 - Fortner; James Isaac ;   et al.
2019-12-05
Dynamic Modulation Of Cross Flow Manifold During Elecroplating
App 20190301042 - Thorkelsson; Kari ;   et al.
2019-10-03
Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation Plating
App 20190264347 - Berke; Aaron ;   et al.
2019-08-29
Dynamic modulation of cross flow manifold during elecroplating
Grant 10,364,505 - Thorkelsson , et al.
2019-07-30
Methods And Apparatus For Controlling Delivery Of Cross Flowing And Impinging Electrolyte During Electroplating
App 20190085479 - Banik, II; Stephen J. ;   et al.
2019-03-21
Methods And Apparatus For Flow Isolation And Focusing During Electroplating
App 20190055665 - Banik, II; Stephen J. ;   et al.
2019-02-21
Integrated Elastomeric Lipseal And Cup Bottom For Reducing Wafer Sticking
App 20190040544 - Berke; Aaron ;   et al.
2019-02-07
Apparatus And Method For Modulating Azimuthal Uniformity In Electroplating
App 20180312991 - Graham; Gabriel Hay ;   et al.
2018-11-01
Apparatus And Method For Electrodeposition Of Metals With The Use Of An Ionically Resistive Ionically Permeable Element Having Spatially Tailored Resistivity
App 20180286660 - Kagajwala; Burhanuddin ;   et al.
2018-10-04
Electroplating Apparatus And Methods Utilizing Independent Control Of Impinging Electrolyte
App 20180258546 - Graham; Gabriel Hay ;   et al.
2018-09-13
Wide Lipseal For Electroplating
App 20180251907 - Thorkelsson; Kari ;   et al.
2018-09-06
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking
Grant 10,053,793 - Berke , et al. August 21, 2
2018-08-21
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity
Grant 10,014,170 - Kagajwala , et al. July 3, 2
2018-07-03
Apparatus and method for modulating azimuthal uniformity in electroplating
Grant 9,988,733 - Graham , et al. June 5, 2
2018-06-05
Dynamic Modulation Of Cross Flow Manifold During Elecroplating
App 20170342583 - Thorkelsson; Kari ;   et al.
2017-11-30
Methods and apparatuses for dynamically tunable wafer-edge electroplating
Grant 9,752,248 - Kagajwala , et al. September 5, 2
2017-09-05
Durable Low Cure Temperature Hydrophobic Coating In Electroplating Cup Assembly
App 20170073832 - Berke; Aaron ;   et al.
2017-03-16
Apparatus and method for dynamic control of plated uniformity with the use of remote electric current
Grant 9,567,685 - Kagajwala , et al. February 14, 2
2017-02-14
Integrated Elastomeric Lipseal And Cup Bottom For Reducing Wafer Sticking
App 20170009369 - Berke; Aaron ;   et al.
2017-01-12
Apparatus And Method For Modulating Azimuthal Uniformity In Electroplating
App 20160362809 - Graham; Gabriel Hay ;   et al.
2016-12-15
Apparatus And Method For Electodeposition Of Metals With The Use Of An Ionically Resistive Ionically Permeable Element Having Spatially Tailored Resistivity
App 20160333495 - Kagajwala; Burhanuddin ;   et al.
2016-11-17
Apparatus And Method For Dynamic Control Of Plated Uniformity With The Use Of Remote Electric Current
App 20160215408 - Kagajwala; Burhanuddin ;   et al.
2016-07-28
Methods And Apparatuses For Dynamically Tunable Wafer-edge Electroplating
App 20160177466 - Kagajawala; Burhanuddin ;   et al.
2016-06-23

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