Patent | Date |
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Substrate Sticking And Breakage Mitigation App 20220220627 - Berke; Aaron ;   et al. | 2022-07-14 |
Cross Flow Conduit For Foaming Prevention In High Convection Plating Cells App 20210395913 - Banik, II; Stephen J. ;   et al. | 2021-12-23 |
Dynamic modulation of cross flow manifold during elecroplating Grant 11,047,059 - Thorkelsson , et al. June 29, 2 | 2021-06-29 |
Methods and apparatus for flow isolation and focusing during electroplating Grant 11,001,934 - Banik, II , et al. May 11, 2 | 2021-05-11 |
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking Grant 10,982,346 - Berke , et al. April 20, 2 | 2021-04-20 |
High flow multi-way piston valve for deposition systems Grant 10,969,036 - Fortner , et al. April 6, 2 | 2021-04-06 |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity Grant 10,923,340 - Kagajwala , et al. February 16, 2 | 2021-02-16 |
Methods and apparatus for controlling delivery of cross flowing and impinging electrolyte during electroplating Grant 10,781,527 - Banik, II , et al. Sept | 2020-09-22 |
Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation Plating App 20200232114 - Berke; Aaron ;   et al. | 2020-07-23 |
Flow assisted dynamic seal for high-convection, continuous-rotation plating Grant 10,612,151 - Berke , et al. | 2020-04-07 |
High Flow Multi-way Piston Valve For Deposition Systems App 20190368630 - Fortner; James Isaac ;   et al. | 2019-12-05 |
Dynamic Modulation Of Cross Flow Manifold During Elecroplating App 20190301042 - Thorkelsson; Kari ;   et al. | 2019-10-03 |
Flow Assisted Dynamic Seal for High-Convection, Continuous-Rotation Plating App 20190264347 - Berke; Aaron ;   et al. | 2019-08-29 |
Dynamic modulation of cross flow manifold during elecroplating Grant 10,364,505 - Thorkelsson , et al. | 2019-07-30 |
Methods And Apparatus For Controlling Delivery Of Cross Flowing And Impinging Electrolyte During Electroplating App 20190085479 - Banik, II; Stephen J. ;   et al. | 2019-03-21 |
Methods And Apparatus For Flow Isolation And Focusing During Electroplating App 20190055665 - Banik, II; Stephen J. ;   et al. | 2019-02-21 |
Integrated Elastomeric Lipseal And Cup Bottom For Reducing Wafer Sticking App 20190040544 - Berke; Aaron ;   et al. | 2019-02-07 |
Apparatus And Method For Modulating Azimuthal Uniformity In Electroplating App 20180312991 - Graham; Gabriel Hay ;   et al. | 2018-11-01 |
Apparatus And Method For Electrodeposition Of Metals With The Use Of An Ionically Resistive Ionically Permeable Element Having Spatially Tailored Resistivity App 20180286660 - Kagajwala; Burhanuddin ;   et al. | 2018-10-04 |
Electroplating Apparatus And Methods Utilizing Independent Control Of Impinging Electrolyte App 20180258546 - Graham; Gabriel Hay ;   et al. | 2018-09-13 |
Wide Lipseal For Electroplating App 20180251907 - Thorkelsson; Kari ;   et al. | 2018-09-06 |
Integrated elastomeric lipseal and cup bottom for reducing wafer sticking Grant 10,053,793 - Berke , et al. August 21, 2 | 2018-08-21 |
Apparatus and method for electrodeposition of metals with the use of an ionically resistive ionically permeable element having spatially tailored resistivity Grant 10,014,170 - Kagajwala , et al. July 3, 2 | 2018-07-03 |
Apparatus and method for modulating azimuthal uniformity in electroplating Grant 9,988,733 - Graham , et al. June 5, 2 | 2018-06-05 |
Dynamic Modulation Of Cross Flow Manifold During Elecroplating App 20170342583 - Thorkelsson; Kari ;   et al. | 2017-11-30 |
Methods and apparatuses for dynamically tunable wafer-edge electroplating Grant 9,752,248 - Kagajwala , et al. September 5, 2 | 2017-09-05 |
Durable Low Cure Temperature Hydrophobic Coating In Electroplating Cup Assembly App 20170073832 - Berke; Aaron ;   et al. | 2017-03-16 |
Apparatus and method for dynamic control of plated uniformity with the use of remote electric current Grant 9,567,685 - Kagajwala , et al. February 14, 2 | 2017-02-14 |
Integrated Elastomeric Lipseal And Cup Bottom For Reducing Wafer Sticking App 20170009369 - Berke; Aaron ;   et al. | 2017-01-12 |
Apparatus And Method For Modulating Azimuthal Uniformity In Electroplating App 20160362809 - Graham; Gabriel Hay ;   et al. | 2016-12-15 |
Apparatus And Method For Electodeposition Of Metals With The Use Of An Ionically Resistive Ionically Permeable Element Having Spatially Tailored Resistivity App 20160333495 - Kagajwala; Burhanuddin ;   et al. | 2016-11-17 |
Apparatus And Method For Dynamic Control Of Plated Uniformity With The Use Of Remote Electric Current App 20160215408 - Kagajwala; Burhanuddin ;   et al. | 2016-07-28 |
Methods And Apparatuses For Dynamically Tunable Wafer-edge Electroplating App 20160177466 - Kagajawala; Burhanuddin ;   et al. | 2016-06-23 |