Bergmann; Yvonne

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bergmann; Yvonne.The latest application filed is for "dispersion for the metallization of contactings".

Company Profile

0.14.16

Bergmann; Yvonne - Altdorf DE
Bergmann; Yvonne - Reutlingen N/A DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
MEMS structural component including a deflectable diaphragm and a fixed counter-element as well as a method for manufacturing it Grant 10,011,479 - Schelling , et al. July 3, 2	2018-07-03
Dispersion for the metallization of contactings Grant 9,324,474 - Weber , et al. April 26, 2	2016-04-26
Method for manufacturing a component having an electrical through-connection Grant 9,114,978 - Reinmuth , et al. August 25, 2	2015-08-25
dispersion for the metallization of contactings App 20150151328 - WEBER; Heribert ; et al.	2015-06-04
Component having through-hole plating, and method for its production Grant 9,035,432 - Reinmuth , et al. May 19, 2	2015-05-19
Method for manufacturing a component having an electrical through-connection Grant 9,034,757 - Reinmuth , et al. May 19, 2	2015-05-19
MEMS structural component including a deflectable diaphragm and a fixed counter-element as well as a method for manufacturing it App 20150001653 - SCHELLING; Christoph ; et al.	2015-01-01
Hybrid integrated component and method for the manufacture thereof Grant 8,836,053 - Weber , et al. September 16, 2	2014-09-16
Component having a through-connection Grant 8,778,194 - Reinmuth , et al. July 15, 2	2014-07-15
Method for producing an electrical feedthrough in a substrate, and a substrate having an electrical feedthrough Grant 8,741,774 - Reinmuth , et al. June 3, 2	2014-06-03
Method For Manufacturing A Component Having An Electrical Through-connection App 20140027927 - REINMUTH; Jochen ; et al.	2014-01-30
Method For Manufacturing A Component Having An Electrical Through-connection App 20130341738 - REINMUTH; Jochen ; et al.	2013-12-26
Component Having Through-hole Plating, And Method For Its Production App 20130341766 - REINMUTH; Jochen ; et al.	2013-12-26
Hybrid Integrated Component And Method For The Manufacture Thereof App 20130299924 - WEBER; Heribert ; et al.	2013-11-14
Component Having A Through-connection App 20130209672 - REINMUTH; Jochen ; et al.	2013-08-15
Component Having A Through-connection App 20130189483 - REINMUTH; Jochen ; et al.	2013-07-25
Method For Producing An Electrical Feedthrough In A Substrate, And A Substrate Having An Electrical Feedthrough App 20130099382 - REINMUTH; Jochen ; et al.	2013-04-25

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.