Bergeron; Christian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bergeron; Christian.The latest application filed is for "mixed under bump metallurgy (ubm) interconnect bridge structure".

Company Profile

4.4.6

Bergeron; Christian - Granby CA
Bergeron; Christian - Quebec CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Mixed under bump metallurgy (UBM) interconnect bridge structure Grant 11,139,269 - Sikka , et al. October 5, 2	2021-10-05
Mixed Under Bump Metallurgy (UBM) Interconnect Bridge Structure App 20210233892 - Sikka; Kamal K. ; et al.	2021-07-29
Sock-lined Footwear And Associated Manufacturing Method App 20200315294 - Bergeron; Alexandre ; et al.	2020-10-08
High-density chip-to-chip interconnection with silicon bridge Grant 10,784,202 - Arguin , et al. Sept	2020-09-22
Metatarsal Guard For Safety Footwear And Method For Manufacturing The Same App 20190350307 - Bergeron; Christian	2019-11-21
High-density Chip-to-chip Interconnection With Silicon Bridge App 20190172787 - Arguin; Francois ; et al.	2019-06-06
Technique for verifying the microstructure of lead-free interconnects in semiconductor assemblies Grant 8,514,386 - Bergeron , et al. August 20, 2	2013-08-20
Technique For Verifying The Microstructure Of Lead-free Interconnects In Semiconductor Assemblies App 20120300220 - Bergeron; Christian ; et al.	2012-11-29
Apparatus and method for non-destructive, low stress removal of soldered electronic components App 20010000208 - Bergeron, Christian ; et al.	2001-04-12

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