| Patent | Date |
|---|
High performance inductors
Grant 11,024,454 - Kim , et al. June 1, 2 | 2021-06-01 |
Hybrid passive-on-glass (POG) acoustic filter
Grant 10,944,379 - Berdy , et al. March 9, 2 | 2021-03-09 |
Integrated circuits (ICs) on a glass substrate
Grant 10,903,240 - Gu , et al. January 26, 2 | 2021-01-26 |
Passive-on-glass (POG) device and method
Grant 10,607,980 - Lan , et al. | 2020-03-31 |
Integrated device comprising a capacitor and inductor structure comprising a shared interconnect for a capacitor and an inductor
Grant 10,498,307 - Velez , et al. De | 2019-12-03 |
Two-dimensional structure to form an embedded three-dimensional structure
Grant 10,490,348 - Velez , et al. Nov | 2019-11-26 |
Integrated Circuits (ics) On A Glass Substrate
App 20190259780 - GU; Shiqun ; et al. | 2019-08-22 |
Land grid array (LGA) packaging of passive-on-glass (POG) structure
Grant 10,361,149 - Zuo , et al. | 2019-07-23 |
Integrated circuits (ICs) on a glass substrate
Grant 10,332,911 - Gu , et al. | 2019-06-25 |
Solenoid inductor
Grant 10,332,671 - Velez , et al. | 2019-06-25 |
Semiconductor assembly and method of making same
Grant 10,319,694 - Kim , et al. | 2019-06-11 |
Substrate comprising an embedded inductor and a thin film magnetic core
Grant 10,290,414 - Yun , et al. | 2019-05-14 |
Skewed co-spiral inductor structure
Grant 10,283,257 - Kim , et al. | 2019-05-07 |
Stacked substrate inductor
Grant 10,249,580 - Kim , et al. | 2019-04-02 |
Compartment shielding in flip-chip (FC) module
Grant 10,242,957 - Kim , et al. | 2019-03-26 |
Integrated Device Comprising A Capacitor And Inductor Structure Comprising A Shared Interconnect For A Capacitor And An Inductor
App 20190081607 - VELEZ; Mario Francisco ; et al. | 2019-03-14 |
Shaped Circuit Wafers
App 20190035621 - YUN; Changhan Hobie ; et al. | 2019-01-31 |
Tunable matching network
Grant 10,187,031 - Ma , et al. Ja | 2019-01-22 |
Interposer device including at least one transistor and at least one through-substrate via
Grant 10,163,771 - Zuo , et al. Dec | 2018-12-25 |
Passive device assembly for accurate ground plane control
Grant 10,154,591 - Zuo , et al. Dec | 2018-12-11 |
Passive components implemented on a plurality of stacked insulators
Grant 10,141,353 - Yun , et al. Nov | 2018-11-27 |
Multi-density MIM capacitor for improved passive on glass (POG) multiplexer performance
Grant 10,141,908 - Mudakatte , et al. Nov | 2018-11-27 |
Double-sided circuit
Grant 10,103,703 - Yun , et al. October 16, 2 | 2018-10-16 |
Open-passivation ball grid array pads
Grant 10,103,116 - Kim , et al. October 16, 2 | 2018-10-16 |
Backside ground plane for integrated circuit
Grant 10,103,135 - Zuo , et al. October 16, 2 | 2018-10-16 |
Wafer level package (WLP) ball support using cavity structure
Grant 10,074,625 - Velez , et al. September 11, 2 | 2018-09-11 |
Encapsulation of acoustic resonator devices
Grant 10,069,474 - Yun , et al. September 4, 2 | 2018-09-04 |
Apparatus with 3D wirewound inductor integrated within a substrate
Grant 10,026,546 - Yun , et al. July 17, 2 | 2018-07-17 |
Passive Device Assembly For Accurate Ground Plane Control
App 20180177052 - Zuo; Chengjie ; et al. | 2018-06-21 |
Hybrid Passive-on-glass (pog) Acoustic Filter
App 20180167054 - BERDY; David Francis ; et al. | 2018-06-14 |
Passive-on-glass (pog) Device And Method
App 20180145062 - Lan; Je-Hsiung Jeffrey ; et al. | 2018-05-24 |
Augmented capacitor structure for high quality (Q)-factor radio frequency (RF) applications
Grant 9,966,426 - Mudakatte , et al. May 8, 2 | 2018-05-08 |
Thin film magnet inductor structure for high quality (Q)-factor radio frequency (RF) applications
Grant 9,959,964 - Yun , et al. May 1, 2 | 2018-05-01 |
Multiplexer design using a 2D passive on glass filter integrated with a 3D through glass via filter
Grant 9,954,267 - Yun , et al. April 24, 2 | 2018-04-24 |
Backside Ground Plane For Integrated Circuit
App 20180090475 - ZUO; Chengjie ; et al. | 2018-03-29 |
Passive device assembly for accurate ground plane control
Grant 9,930,783 - Zuo , et al. March 27, 2 | 2018-03-27 |
Face-to-face Multiplexer Circuit Layout
App 20180083589 - YUN; Changhan Hobie ; et al. | 2018-03-22 |
Electrode Wrap-around Capacitors For Radio Frequency (rf) Applications
App 20180083588 - YUN; Changhan Hobie ; et al. | 2018-03-22 |
Passives In Thin Film
App 20180077803 - YUN; Changhan Hobie ; et al. | 2018-03-15 |
Frequency multiplexer
Grant 9,906,318 - Zuo , et al. February 27, 2 | 2018-02-27 |
Multi-density Mim Capacitor For Improved Passive On Glass (pog) Multiplexer Performance
App 20180054177 - MUDAKATTE; Niranjan Sunil ; et al. | 2018-02-22 |
Land Grid Array (lga) Packaging Of Passive-on-glass (pog) Structure
App 20180047660 - ZUO; Chengjie ; et al. | 2018-02-15 |
Semiconductor Assembly And Method Of Making Same
App 20180047687 - KIM; Daeik Daniel ; et al. | 2018-02-15 |
Passive-on-glass (POG) device and method
Grant 9,893,048 - Lan , et al. February 13, 2 | 2018-02-13 |
Interposer Device Including At Least One Transistor And At Least One Through-substrate Via
App 20180040547 - Zuo; Chengjie ; et al. | 2018-02-08 |
LC filter layer stacking by layer transfer to make 3D multiplexer structures
Grant 9,876,513 - Yun , et al. January 23, 2 | 2018-01-23 |
MIM capacitor and method of making the same
Grant 9,875,848 - Berdy , et al. January 23, 2 | 2018-01-23 |
Stacked Substrate Inductor
App 20170373025 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
Exposed Side-wall And Lga Assembly
App 20170372989 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
Inline Kerf Probing Of Passive Devices
App 20170372975 - KIM; Daeik Daniel ; et al. | 2017-12-28 |
Two-dimensional Structure To Form An Embedded Three-dimensional Structure
App 20170372831 - VELEZ; Mario Francisco ; et al. | 2017-12-28 |
Passive Components Implemented On A Plurality Of Stacked Insulators
App 20170338255 - YUN; Changhan Hobie ; et al. | 2017-11-23 |
Apparatus With 3d Wirewound Inductor Integrated Within A Substrate
App 20170338034 - Yun; Changhan Hobie ; et al. | 2017-11-23 |
Double-sided Circuit
App 20170338788 - YUN; Changhan Hobie ; et al. | 2017-11-23 |
Tunable Matching Network
App 20170331445 - Ma; Yunfei ; et al. | 2017-11-16 |
Density-optimized module-level inductor ground structure
Grant 9,807,882 - Berdy , et al. October 31, 2 | 2017-10-31 |
Lc Filter Layer Stacking By Layer Transfer To Make 3d Multiplexer Structures
App 20170288707 - YUN; Changhan Hobie ; et al. | 2017-10-05 |
Side-assembled passive devices
Grant 9,780,048 - Berdy , et al. October 3, 2 | 2017-10-03 |
Passive Device Assembly For Accurate Ground Plane Control
App 20170280562 - Zuo; Chengjie ; et al. | 2017-09-28 |
Integrated circuits (ICS) on a glass substrate
Grant 9,768,109 - Gu , et al. September 19, 2 | 2017-09-19 |
Open-passivation Ball Grid Array Pads
App 20170221846 - KIM; Daeik Daniel ; et al. | 2017-08-03 |
Backside coupled symmetric varactor structure
Grant 9,721,946 - Kim , et al. August 1, 2 | 2017-08-01 |
Skewed Co-spiral Inductor Structure
App 20170200550 - KIM; Daeik Daniel ; et al. | 2017-07-13 |
Multiplexer Design Using A 2d Passive On Glass Filter Integrated With A 3d Through Glass Via Filter
App 20170187345 - YUN; Changhan Hobie ; et al. | 2017-06-29 |
Mim Capacitor And Method Of Making The Same
App 20170178810 - BERDY; David Francis ; et al. | 2017-06-22 |
Superposed structure 3D orthogonal through substrate inductor
Grant 9,666,362 - Berdy , et al. May 30, 2 | 2017-05-30 |
Acoustic Resonator Devices
App 20170141756 - Yun; Changhan Hobie ; et al. | 2017-05-18 |
Thin Film Magnet Inductor Structure For High Quality (q)-factor Radio Frequency (rf) Applications
App 20170140862 - YUN; Changhan Hobie ; et al. | 2017-05-18 |
Metal-insulator-metal (mim) Array For Integrated Radio Frequency (rf) Filter
App 20170133996 - Kim; Daeik Daniel ; et al. | 2017-05-11 |
Solenoid Inductor
App 20170133148 - VELEZ; Mario Francisco ; et al. | 2017-05-11 |
High Performance Inductors
App 20170110237 - KIM; Daeik Daniel ; et al. | 2017-04-20 |
Radio-frequency (RF) shielding in fan-out wafer level package (FOWLP)
Grant 9,620,463 - Kim , et al. April 11, 2 | 2017-04-11 |
Integrated Circuits (ics) On A Glass Substrate
App 20170098663 - Gu; Shiqun ; et al. | 2017-04-06 |
Integrated Circuits (ics) On A Glass Substrate
App 20170084531 - Gu; Shiqun ; et al. | 2017-03-23 |
Wafer Level Package (wlp) Ball Support Using Cavity Structure
App 20170084565 - VELEZ; Mario Francisco ; et al. | 2017-03-23 |
Backside Coupled Symmetric Varactor Structure
App 20170077093 - KIM; Daeik Daniel ; et al. | 2017-03-16 |
Augmented Capacitor Structure For High Quality (q)-factor Radio Frequency (rf) Applications
App 20170077214 - MUDAKATTE; Niranjan Sunil ; et al. | 2017-03-16 |
Passive-on-glass (pog) Device And Method
App 20170077079 - Lan; Je-Hsiung Jeffrey ; et al. | 2017-03-16 |
Substrate Comprising An Embedded Inductor And A Thin Film Magnetic Core
App 20170062120 - Yun; Changhan Hobie ; et al. | 2017-03-02 |
Tunable Cavity Resonator
App 20170033429 - Berdy; David Francis ; et al. | 2017-02-02 |
Devices and methods to reduce stress in an electronic device
Grant 9,560,745 - Kim , et al. January 31, 2 | 2017-01-31 |
Backside coupled symmetric varactor structure
Grant 9,502,586 - Kim , et al. November 22, 2 | 2016-11-22 |
Vertical spiral inductor
Grant 9,478,348 - Kim , et al. October 25, 2 | 2016-10-25 |
Multi-Axis Levitating Vibration Energy Harvester
App 20160276914 - Peroulis; Dimitrios ; et al. | 2016-09-22 |
Compartment Shielding In Flip-chip (fc) Module
App 20160254236 - KIM; Daeik Daniel ; et al. | 2016-09-01 |
Radio-frequency (rf) Shielding In Fan-out Wafer Level Package (fowlp)
App 20160254237 - KIM; Daeik Daniel ; et al. | 2016-09-01 |
Three Dimensional (3d) Antenna Structure
App 20160248149 - Kim; Daeik Daniel ; et al. | 2016-08-25 |
Metal-insulator-metal (mim) Capacitors Arranged In A Pattern To Reduce Inductance, And Related Methods
App 20160181233 - Yun; Changhan Hobie ; et al. | 2016-06-23 |
Superposed Structure 3d Orthogonal Through Substrate Inductor
App 20160163450 - BERDY; David Francis ; et al. | 2016-06-09 |
Stress mitigation structure for wafer warpage reduction
Grant 9,343,403 - Lan , et al. May 17, 2 | 2016-05-17 |
Devices And Methods To Reduce Stress In An Electronic Device
App 20160095208 - Kim; Daeik Daniel ; et al. | 2016-03-31 |
Varactor Device With Backside Contact
App 20160093750 - Kim; Daeik Daniel ; et al. | 2016-03-31 |
Superposed Structure 3d Orthogonal Through Substrate Inductor
App 20160020013 - BERDY; David Francis ; et al. | 2016-01-21 |
Vertical Spiral Inductor
App 20150371751 - KIM; Daeik Daniel ; et al. | 2015-12-24 |
Die package comprising die-to-wire connector and a wire-to-die connector configured to couple to a die package
Grant 9,202,789 - Kim , et al. December 1, 2 | 2015-12-01 |
Die Package Comprising Die-to-wire Connector And A Wire-to-die Connector Configured To Couple To A Die Package
App 20150303148 - Kim; Daeik Daniel ; et al. | 2015-10-22 |
Frequency Multiplexer
App 20150304059 - Zuo; Chengjie ; et al. | 2015-10-22 |
Stress Mitigation Structure For Wafer Warpage Reduction
App 20150287677 - LAN; Je-Hsiung Jeffrey ; et al. | 2015-10-08 |
Compact 3-D coplanar transmission lines
Grant 9,136,574 - Kim , et al. September 15, 2 | 2015-09-15 |
Lateral Metal Insulator Metal (mim) Capacitor With High-q And Reduced Area
App 20150200245 - YUN; Changhan Hobie ; et al. | 2015-07-16 |
Compact 3-d Coplanar Transmission Lines
App 20140361854 - Kim; Daeik Daniel ; et al. | 2014-12-11 |
High Density, Low Loss 3-d Through-glass Inductor With Magnetic Core
App 20140247269 - Berdy; David Francis ; et al. | 2014-09-04 |
| 