Berdy; David F.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Berdy; David F..The latest application filed is for "tunable diplexers in three-dimensional (3d) integrated circuits (ic) (3dic) and related components and methods".

Company Profile

0.4.7

Berdy; David F. - West Lafayette IN
Berdy; David F. - San Diego CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Capacitor with a dielectric between a via and a plate of the capacitor Grant 9,935,166 - Lan , et al. April 3, 2	2018-04-03
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods Grant 9,813,043 - Zuo , et al. November 7, 2	2017-11-07
Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods Grant 9,634,640 - Zuo , et al. April 25, 2	2017-04-25
Tunable Diplexers In Three-dimensional (3d) Integrated Circuits (ic) (3dic) And Related Components And Methods App 20160204758 - Zuo; Chengjie ; et al.	2016-07-14
Diplexer design using through glass via technology Grant 9,203,373 - Zuo , et al. December 1, 2	2015-12-01
Inductive Device That Includes Conductive Via And Metal Layer App 20150035162 - Lan; Je-Hsiung ; et al.	2015-02-05
Inductor Tunable By A Variable Magnetic Flux Density Component App 20140327508 - Kim; Daeik D. ; et al.	2014-11-06
Electronic Device Having Asymmetrical Through Glass Vias App 20140327510 - Kim; Daeik D. ; et al.	2014-11-06
Tunable Diplexers In Three-dimensional (3d) Integrated Circuits (ic) (3dic) And Related Components And Methods App 20140327496 - Zuo; Chengjie ; et al.	2014-11-06
Capacitor With A Dielectric Between A Via And A Plate Of The Capacitor App 20140268616 - Lan; Je-Hsiung ; et al.	2014-09-18
Diplexer Design Using Through Glass Via Technology App 20140197902 - Zuo; Chengjie ; et al.	2014-07-17

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