Beom; Won Jin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Beom; Won Jin.The latest application filed is for "surface-treated copper foil, manufacturing method thereof, copper foil laminate including the same, and printed wiring board including the same".
- Beom; Won Jin - Jeollabuk-do KR
- Beom; Won Jin - Iksan-si KR
| Patent | Date |
|---|---|
| Carrier-foil-attached ultra-thin copper foil Grant 11,164,831 - Beom , et al. November 2, 2 | 2021-11-02 |
| Carrier-foil-attached ultra-thin copper foil Grant 11,166,378 - Beom , et al. November 2, 2 | 2021-11-02 |
| Surface-treated Copper Foil, Manufacturing Method Thereof, Copper Foil Laminate Including The Same, And Printed Wiring Board Including The Same App 20210195737 - Yoon; Sang Hwa ; et al. | 2021-06-24 |
| Carrier-foil-attached Ultra-thin Copper Foil App 20190371750 - Beom; Won Jin ; et al. | 2019-12-05 |
| Carrier-foil-attached Ultra-thin Copper Foil App 20190364664 - Beom; Won Jin ; et al. | 2019-11-28 |
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