| Patent | Date |
|---|
Wafer-level packaged microelectronic imagers having interconnects formed through terminals
Grant 8,816,463 - Akram , et al. August 26, 2 | 2014-08-26 |
Apparatus For Non-chemical, Non-optical Edge Bead Removal
App 20140130981 - Benson; Peter A. | 2014-05-15 |
Non-chemical, non-optical edge bead removal process
Grant 8,641,831 - Benson February 4, 2 | 2014-02-04 |
Non-Chemical, Non-Optical Edge Bead Removal Process
App 20120234361 - Benson; Peter A. | 2012-09-20 |
Non-chemical, non-optical edge bead removal process
Grant 8,192,555 - Benson June 5, 2 | 2012-06-05 |
Wafer-level Packaged Microelectronic Imagers And Processes For Wafer-level Packaging
App 20120104528 - Akram; Salman ; et al. | 2012-05-03 |
Semiconductor devices and assemblies including back side redistribution layers in association with through wafer interconnects
Grant 7,994,547 - Benson , et al. August 9, 2 | 2011-08-09 |
Microelectronics devices, having vias, and packaged microelectronic devices having vias
Grant 7,759,800 - Rigg , et al. July 20, 2 | 2010-07-20 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,709,776 - Farnworth , et al. May 4, 2 | 2010-05-04 |
Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
Grant 7,629,250 - Benson , et al. December 8, 2 | 2009-12-08 |
Apparatus for spin coating semiconductor substrates
Grant 7,615,119 - Benson November 10, 2 | 2009-11-10 |
Systems and methods for retrieving residual liquid during immersion lens photolithography
Grant 7,583,358 - Benson September 1, 2 | 2009-09-01 |
Methods for packing microfeature devices and microfeature devices formed by such methods
Grant 7,579,684 - Benson , et al. August 25, 2 | 2009-08-25 |
Method for creating conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
Grant 7,575,999 - Benson , et al. August 18, 2 | 2009-08-18 |
Microelectronic Imagers With Optical Devices And Methods Of Manufacturing Such Microelectronic Imagers
App 20090155949 - Farnworth; Warren M. ; et al. | 2009-06-18 |
Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material
Grant 7,521,296 - Wood , et al. April 21, 2 | 2009-04-21 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,504,615 - Farnworth , et al. March 17, 2 | 2009-03-17 |
Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same
Grant 7,488,618 - Wood , et al. February 10, 2 | 2009-02-10 |
Semiconductor wafer assemblies
Grant 7,489,020 - Benson February 10, 2 | 2009-02-10 |
Low Temperature Methods Of Forming Back Side Redistribution Layers In Association With Through Wafer Interconnects, Semiconductor Devices Including Same, And Assemblies
App 20080277799 - Benson; Peter A. ; et al. | 2008-11-13 |
Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials
Grant 7,442,643 - Wood , et al. October 28, 2 | 2008-10-28 |
Low temperature methods of forming back side redistribution layers in association with through wafer interconnects
Grant 7,435,620 - Benson , et al. October 14, 2 | 2008-10-14 |
Microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,419,841 - Farnworth , et al. September 2, 2 | 2008-09-02 |
Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies
Grant 7,419,852 - Benson , et al. September 2, 2 | 2008-09-02 |
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
Grant 7,413,979 - Rigg , et al. August 19, 2 | 2008-08-19 |
Methods of packaging and testing microelectronic imaging devices
Grant 7,341,881 - Watkins , et al. March 11, 2 | 2008-03-11 |
Low Temperature Methods Of Forming Back Side Redistribution Layers In Association With Through Wafer Interconnects
App 20070259517 - Benson; Peter A. ; et al. | 2007-11-08 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,265,330 - Farnworth , et al. September 4, 2 | 2007-09-04 |
Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
Grant 7,253,957 - Akram , et al. August 7, 2 | 2007-08-07 |
Substrate supports for use with programmable material consolidation apparatus and systems
App 20070179654 - Hiatt; William M. ; et al. | 2007-08-02 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20070170350 - Farnworth; Warren M. ; et al. | 2007-07-26 |
Methods for supporting substrates during fabrication of one or more objects thereon by programmed material consolidation techniques
App 20070168074 - Hiatt; William M. ; et al. | 2007-07-19 |
Wafer edge ring structures and methods of formation
Grant 7,244,665 - Benson July 17, 2 | 2007-07-17 |
Methods for removing and reclaiming unconsolidated material from substrates following fabrication of objects thereon by programmed material consolidation techniques
App 20070157952 - Hiatt; William M. ; et al. | 2007-07-12 |
Substrate supports for use with programmable material consolidation apparatus and systems
Grant 7,239,933 - Hiatt , et al. July 3, 2 | 2007-07-03 |
Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
Grant 7,235,431 - Wood , et al. June 26, 2 | 2007-06-26 |
Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques
Grant 7,225,044 - Hiatt , et al. May 29, 2 | 2007-05-29 |
Microelectronic imagers and methods of packaging microelectronic imagers
Grant 7,199,439 - Farnworth , et al. April 3, 2 | 2007-04-03 |
Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
App 20070066048 - Benson; Peter A. ; et al. | 2007-03-22 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
Grant 7,189,954 - Farnworth , et al. March 13, 2 | 2007-03-13 |
Systems and methods for retrieving residual liquid during immersion lens photolithography
App 20070019172 - Benson; Peter A. | 2007-01-25 |
Methods for packaging microfeature devices and microfeature devices formed by such methods
Grant 7,157,310 - Benson , et al. January 2, 2 | 2007-01-02 |
Microelectronic imagers and methods of packaging microelectronic imagers
App 20060261340 - Farnworth; Warren M. ; et al. | 2006-11-23 |
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
App 20060264041 - Rigg; Sidney B. ; et al. | 2006-11-23 |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging device
App 20060255418 - Watkins; Charles M. ; et al. | 2006-11-16 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20060243889 - Farnworth; Warren M. ; et al. | 2006-11-02 |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
Grant 7,115,961 - Watkins , et al. October 3, 2 | 2006-10-03 |
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
App 20060216862 - Rigg; Sidney B. ; et al. | 2006-09-28 |
Methods for packaging microfeature devices and microfeature devices formed by such methods
App 20060205116 - Benson; Peter A. ; et al. | 2006-09-14 |
Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices have conductive complementary structures
App 20060202315 - Benson; Peter A. ; et al. | 2006-09-14 |
Semiconductor wafer assemblies
App 20060192283 - Benson; Peter A. | 2006-08-31 |
Apparatus for spin coating semiconductor substrates
App 20060191475 - Benson; Peter A. | 2006-08-31 |
Methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
Grant 7,091,124 - Rigg , et al. August 15, 2 | 2006-08-15 |
Microlenses including a plurality of mutually adhered layers of optically transmissive material and systems including the same
App 20060134827 - Wood; Alan G. ; et al. | 2006-06-22 |
Methods of forming conductive elements using organometallic layers and flowable, curable conductive materials
App 20060115926 - Wood; Alan G. ; et al. | 2006-06-01 |
Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material
App 20060115925 - Wood; Alan G. ; et al. | 2006-06-01 |
Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies
App 20060043569 - Benson; Peter A. ; et al. | 2006-03-02 |
Packaged microelectronic imaging devices and methods of packaging microelectronic imaging devices
App 20060043509 - Watkins; Charles M. ; et al. | 2006-03-02 |
Method for creating electrically conductive elements for semiconductor device structures using laser ablation processes and methods of fabricating semiconductor device assemblies
App 20060046461 - Benson; Peter A. ; et al. | 2006-03-02 |
Methods for packaging microfeature devices and microfeature devices formed by such methods
App 20060046346 - Benson; Peter A. ; et al. | 2006-03-02 |
Die package, conductive element, semiconductor device including same, microlens, system including same, and methods of manufacture
App 20060046347 - Wood; Alan G. ; et al. | 2006-03-02 |
Microelectronic imagers with optical devices and methods of manufacturing such microelectronic imagers
App 20060011809 - Farnworth; Warren M. ; et al. | 2006-01-19 |
Microelectronic imagers and methods of packaging microelectronic imagers
App 20050275048 - Farnworth, Warren M. ; et al. | 2005-12-15 |
Wafer-level packaged microelectronic imagers and processes for wafer-level packaging
App 20050275750 - Akram, Salman ; et al. | 2005-12-15 |
Integrated optics units and methods of manufacturing integrated optics units for use with microelectronic imagers
App 20050254133 - Akram, Salman ; et al. | 2005-11-17 |
Wafer edge ring structures and methods of formation
App 20050245005 - Benson, Peter A. | 2005-11-03 |
Microelectronic devices, methods for forming vias in microelectronic devices, and methods for packaging microelectronic devices
App 20050104228 - Rigg, Sidney B. ; et al. | 2005-05-19 |
Microelectronic devices having conductive complementary structures and methods of manufacturing microelectronic devices having conductive complementary structures
App 20050104171 - Benson, Peter A. ; et al. | 2005-05-19 |
Substrate supports for use with programmable material consolidation apparatus and systems
App 20040186608 - Hiatt, William M. ; et al. | 2004-09-23 |
Handling system for use with programmable material consolidation systems and associated methods
App 20040167663 - Hiatt, William M. ; et al. | 2004-08-26 |
Cleaning components for use with programmable material consolidation apparatus and systems
App 20040159344 - Hiatt, William M. ; et al. | 2004-08-19 |
Methods for removing and reclaiming unconsolidated material from substrates following fabrication of objects thereon by programmed material consolidation techniques
App 20040159340 - Hiatt, William M. ; et al. | 2004-08-19 |
Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniques
App 20040158343 - Hiatt, William M. ; et al. | 2004-08-12 |
Non-chemical, non-optical edge bead removal process
App 20040126923 - Benson, Peter A. | 2004-07-01 |
Composition for circuit board manufacture
Grant 6,261,466 - Bayes , et al. July 17, 2 | 2001-07-17 |
| 