Bennett; Daniel D.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bennett; Daniel D..The latest application filed is for "window assembly with electrically conductive compressible member".
- Bennett; Daniel D. - Tecumseh MI
| Patent | Date |
|---|---|
| Window assembly with casing for solder joint Grant 10,601,149 - Bennett , et al. | 2020-03-24 |
| Window assembly with electrically conductive compressible member Grant 9,966,673 - Bennett , et al. May 8, 2 | 2018-05-08 |
| Window Assembly With Casing For Solder Joint App 20160204522 - Bennett; Daniel D. ; et al. | 2016-07-14 |
| Window Assembly With Electrically Conductive Compressible Member App 20160204524 - Bennett; Daniel D. ; et al. | 2016-07-14 |
| Busbar For An Electrical Device And A Window Pane Including The Same App 20150314757 - Bennett; Daniel D. ; et al. | 2015-11-05 |
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