Benner; Stephen J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Benner; Stephen J..The latest application filed is for "slurry slip stream controller for cmp system".

Company Profile

0.12.15

Benner; Stephen J. - Lansdale PA
Benner; Stephen J. - Landsdale PA
Benner; Stephen J. - Montgomery PA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Slurry Slip Stream Controller For CMP System App 20170355059 - Benner; Stephen J.	2017-12-14
System for measuring and controlling the level of vacuum applied to a conditioning holder within a CMP system Grant 8,025,555 - Benner September 27, 2	2011-09-27
Active Tribology Management of CMP Polishing Material App 20110177623 - Benner; Stephen J. ; et al.	2011-07-21
Cleaning cup system for chemical mechanical planarization apparatus Grant 7,913,705 - Benner March 29, 2	2011-03-29
Vacuum line clean-out separator system Grant 7,909,910 - Benner March 22, 2	2011-03-22
Method for controlling the forces applied to a vacuum-assisted pad conditioning system Grant 7,901,267 - Benner March 8, 2	2011-03-08
Apertured Abrasive Disk Assembly With Improved Flow Dynamics App 20110039485 - Benner; Stephen J. ; et al.	2011-02-17
In-line effluent analysis method and apparatus for CMP process control App 20090287340 - Benner; Stephen J. ; et al.	2009-11-19
Vacuum-assisted pad conditioning system Grant 7,575,503 - Benner August 18, 2	2009-08-18
Apparatus for controlling the forces applied to a vacuum-assisted pad conditioning system Grant 7,544,113 - Benner June 9, 2	2009-06-09
Cleaning cup system for chemical mechanical planarization apparatus App 20080202568 - Benner; Stephen J.	2008-08-28
Abrasive configuration for fluid dynamic removal of abraded material and the like App 20080160883 - Benner; Stephen J.	2008-07-03
Vacuum line clean-out separator system App 20080092734 - Benner; Stephen J.	2008-04-24
Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk App 20070281592 - Benner; Stephen J.	2007-12-06
Enhanced end effector arm arrangement for CMP pad conditioning App 20070207705 - Benner; Stephen J.	2007-09-06
Vacuum-assisted pad conditioning system Grant 7,258,600 - Benner August 21, 2	2007-08-21
Enhanced end effector arm arrangement for CMP pad conditioning Grant 7,217,172 - Benner May 15, 2	2007-05-15
Apertured conditioning brush for chemical mechanical planarization systems App 20070087672 - Benner; Stephen J.	2007-04-19
Chemical mechanical planarization process control utilizing in-situ conditioning process Grant 7,166,014 - Benner , et al. January 23, 2	2007-01-23
Enhanced end effector arm arrangement for CMP pad conditioning App 20070010172 - Benner; Stephen J.	2007-01-11
Vacuum-assisted pad conditioning system and method utilizing an apertured conditioning disk Grant 7,052,371 - Benner May 30, 2	2006-05-30
Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization Grant 7,040,967 - Benner May 9, 2	2006-05-09
Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization App 20050186891 - Benner, Stephen J.	2005-08-25
Chemical mechanical planarization process control utilizing in-situ conditioning process App 20050164606 - Benner, Stephen J. ; et al.	2005-07-28
Method of using multiple, different slurries in a CMP polishing process via a pad conditioning system App 20040241989 - Benner, Stephen J.	2004-12-02
Polishing pad conditioning system Grant 6,508,697 - Benner , et al. January 21, 2	2003-01-21
Polishing Pad Conditioning System App 20030013381 - Benner, Robert Lyle ; et al.	2003-01-16

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