Benjavasukul; Woraya

Patent Applications and Registrations

Patent applications and USPTO patent grants for Benjavasukul; Woraya.The latest application filed is for "metallic solderability preservation coating on metal part of semiconductor package to prevent oxide".

Company Profile

0.8.3

Benjavasukul; Woraya - Bangkok TH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor package with partial plating on contact side surfaces Grant 10,204,850 - Nondhasitthichai , et al. Feb	2019-02-12
Semiconductor package with partial plating on contact side surfaces Grant 9,773,722 - Nondhasitthichai , et al. September 26, 2	2017-09-26
Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide Grant 8,569,877 - Benjavasukul , et al. October 29, 2	2013-10-29
Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide Grant 8,431,443 - Benjavasukul , et al. April 30, 2	2013-04-30
Metallic solderability preservation coating on metal part of semiconductor package to prevent oxide Grant 8,367,476 - Benjavasukul , et al. February 5, 2	2013-02-05
Metallic Solderability Preservation Coating On Metal Part Of Semiconductor Package To Prevent Oxide App 20110232693 - Benjavasukul; Woraya ; et al.	2011-09-29
Metallic Solderability Preservation Coating On Metal Part Of Semiconductor Package To Prevent Oxide App 20100230802 - Benjavasukul; Woraya ; et al.	2010-09-16
Metallic Solderability Preservation Coating On Metal Part Of Semiconductor Package To Prevent Oxide App 20100233854 - Benjavasukul; Woraya ; et al.	2010-09-16

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