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Patent applications and USPTO patent grants for Beninati; Gregory G..The latest application filed is for "component manufacture and external inspection".
Patent | Date |
---|---|
Component Manufacture And External Inspection App 20220297248 - Mayberry; Travis ;   et al. | 2022-09-22 |
PCB cavity mode suppression Grant 11,317,502 - Sikina , et al. April 26, 2 | 2022-04-26 |
Preparation Of Solder Bump For Compatibility With Printed Electronics And Enhanced Via Reliability App 20210400820 - Benedict; James E. ;   et al. | 2021-12-23 |
Pcb Cavity Mode Suppression App 20210360772 - Sikina; Thomas V. ;   et al. | 2021-11-18 |
Preparation of solder bump for compatibility with printed electronics and enhanced via reliability Grant 11,122,692 - Benedict , et al. September 14, 2 | 2021-09-14 |
Method For Forming Channels In Printed Circuit Boards By Stacking Slotted Layers App 20210144864 - Pevzner; Mikhail ;   et al. | 2021-05-13 |
Method of wire bonding a first and second circuit card Grant 10,999,938 - Pevzner , et al. May 4, 2 | 2021-05-04 |
Heat exchanger assembly Grant 10,775,109 - Nelson , et al. September 15, 2 | 2020-09-15 |
Heat Exchanger Assembly App 20180306522 - Nelson; N.D. ;   et al. | 2018-10-25 |
Cooling structure for integrated circuits and methods for forming such structure Grant 10,026,674 - Wahl , et al. July 17, 2 | 2018-07-17 |
Cooling Structure For Integrated Circuits And Methods For Forming Such Structure App 20170178996 - Wahl; Joseph M. ;   et al. | 2017-06-22 |
Heat exchanger assembly App 20100163211 - Nelson; N. D. ;   et al. | 2010-07-01 |
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