Beng; Lau Teck
Patent Applications and Registrations
Patent applications and USPTO patent grants for Beng; Lau Teck.The latest application filed is for "stacked die sensor package".
- Beng; Lau Teck - Petaling Jaya MY
- Beng; Lau Teck - Kuala Lumpur MY
| Patent | Date |
|---|---|
| Stacked die sensor package Grant 9,134,193 - Foong , et al. September 15, 2 | 2015-09-15 |
| Stacked Die Sensor Package App 20150160087 - Foong; Chee Seng ; et al. | 2015-06-11 |
| Side Vented Pressure Sensor Device App 20150076630 - Low; Boon Yew ; et al. | 2015-03-19 |
| Wirebonding insulated wire and capillary therefor Grant 7,261,230 - Harun , et al. August 28, 2 | 2007-08-28 |
| Wirebonding insulated wire and capillary therefor App 20050045692 - Harun, Fuaida ; et al. | 2005-03-03 |
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