Benenati; Joseph A.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Benenati; Joseph A..The latest application filed is for "thermal enhancement approach using solder compositions in the liquid state".
- Benenati; Joseph A. - Hopewell Junction NY
- Benenati; Joseph A. - Dutchess County NY
| Patent | Date |
|---|---|
| Thermal enhancement approach using solder compositions in the liquid state Grant 6,656,770 - Atwood , et al. December 2, 2 | 2003-12-02 |
| Rolling ball connector Grant 6,358,627 - Benenati , et al. March 19, 2 | 2002-03-19 |
| Thermal enhancement approach using solder compositions in the liquid state App 20010026957 - Atwood, Eugene R. ; et al. | 2001-10-04 |
| Thermal enhancement approach using solder compositions in the liquid state Grant 6,281,573 - Atwood , et al. August 28, 2 | 2001-08-28 |
| Underfill preform interposer for joining chip to substrate Grant 6,258,627 - Benenati , et al. July 10, 2 | 2001-07-10 |
| Rolling ball connector App 20010002330 - Benenati, Joseph A. ; et al. | 2001-05-31 |
| Zero force heat sink Grant 6,212,070 - Atwood , et al. April 3, 2 | 2001-04-03 |
| Rolling ball connector Grant 6,177,729 - Benenati , et al. January 23, 2 | 2001-01-23 |
| Zero force heat sink Grant 5,805,430 - Atwood , et al. September 8, 1 | 1998-09-08 |
| Solder ball interconnected assembly Grant 5,591,941 - Acocella , et al. January 7, 1 | 1997-01-07 |
| Apparatus for removing a heatsink from an electronic module or package Grant 5,297,618 - Behun , et al. March 29, 1 | 1994-03-29 |
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