Benedict; James E.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Benedict; James E..The latest application filed is for "ball bond impedance matching".
Company Profile
21.19.27
- Benedict; James E. - Lowell MA
- Benedict; James E. - Chelmsford MA
- Benedict; James E. - North Chelmsford MA
- Benedict; James E. - Tewksbury MA
Patent Activity
| Patent | Date |
|---|---|
| Additive manufactured reactive beamformer Grant 11,432,408 - Sikina , et al. August 30, 2 | 2022-08-30 |
| Ball Bond Impedance Matching App 20220254750 - Boyle; Patrick E. ; et al. | 2022-08-11 |
| Method of manufacturing radio frequency interconnections Grant 11,375,609 - Sikina , et al. June 28, 2 | 2022-06-28 |
| Spiral Antenna And Related Fabrication Techniques App 20220140485 - Adams; Peter J. ; et al. | 2022-05-05 |
| PCB cavity mode suppression Grant 11,317,502 - Sikina , et al. April 26, 2 | 2022-04-26 |
| Spiral antenna and related fabrication techniques Grant 11,289,814 - Adams , et al. March 29, 2 | 2022-03-29 |
| Low Profile Phased Array App 20220052460 - Sikina; Thomas V. ; et al. | 2022-02-17 |
| Preparation Of Solder Bump For Compatibility With Printed Electronics And Enhanced Via Reliability App 20210400820 - Benedict; James E. ; et al. | 2021-12-23 |
| System And Method For Fabricating Z-axis Vertical Launch App 20210368629 - Pevzner; Mikhail ; et al. | 2021-11-25 |
| Pcb Cavity Mode Suppression App 20210360772 - Sikina; Thomas V. ; et al. | 2021-11-18 |
| Process for removing bond film from cavities in printed circuit boards Grant 11,171,101 - Benedict , et al. November 9, 2 | 2021-11-09 |
| Low profile phased array Grant 11,158,955 - Sikina , et al. October 26, 2 | 2021-10-26 |
| Interlocking modular beamformer Grant 11,145,977 - Wilder , et al. October 12, 2 | 2021-10-12 |
| Advanced communications array Grant 11,145,952 - Sikina , et al. October 12, 2 | 2021-10-12 |
| Process For Removing Bond Film From Cavities In Printed Circuit Boards App 20210305187 - Benedict; James E. ; et al. | 2021-09-30 |
| Preparation of solder bump for compatibility with printed electronics and enhanced via reliability Grant 11,122,692 - Benedict , et al. September 14, 2 | 2021-09-14 |
| Additive manufacturing technology (AMT) low profile radiator Grant 11,121,474 - Haven , et al. September 14, 2 | 2021-09-14 |
| Apparatus for fabricating Z-axis vertical launch within a printed circuit board Grant 11,109,489 - Pevzner , et al. August 31, 2 | 2021-08-31 |
| Thick film resistors having customizable resistances and methods of manufacture Grant 11,107,610 - Klek , et al. August 31, 2 | 2021-08-31 |
| Additive manufacturing technology (AMT) low profile signal divider Grant 11,089,687 - Nufio-Molina , et al. August 10, 2 | 2021-08-10 |
| Advanced Communications Array App 20210151855 - Sikina; Thomas V. ; et al. | 2021-05-20 |
| Method For Forming Channels In Printed Circuit Boards By Stacking Slotted Layers App 20210144864 - Pevzner; Mikhail ; et al. | 2021-05-13 |
| Printed Circuit Board Automated Layup System App 20210144892 - Pevzner; Mikhail ; et al. | 2021-05-13 |
| Method of wire bonding a first and second circuit card Grant 10,999,938 - Pevzner , et al. May 4, 2 | 2021-05-04 |
| Snap-rf Interconnections App 20210059043 - Sikina; Thomas V. ; et al. | 2021-02-25 |
| System And Method For Fabricating Z-axis Vertical Launch App 20210051805 - Pevzner; Mikhail ; et al. | 2021-02-18 |
| Interlocking Modular Beamformer App 20200395651 - Wilder; Kevin ; et al. | 2020-12-17 |
| SNAP-RF interconnections Grant 10,849,219 - Sikina , et al. November 24, 2 | 2020-11-24 |
| Flat-wire Copper Vertical Launch Microwave Interconnection Method App 20200367357 - Benedict; James E. ; et al. | 2020-11-19 |
| Thick Film Resistors Having Customizable Resistances And Methods Of Manufacture App 20200365300 - Klek; Erika C. ; et al. | 2020-11-19 |
| Thick film resistors having customizable resistances and methods of manufacture Grant 10,839,992 - Klek , et al. November 17, 2 | 2020-11-17 |
| Radio frequency circuit with a multi-layer transmission line assembly having a conductively filled trench surrounding the transmission line Grant 10,826,147 - Sikina , et al. November 3, 2 | 2020-11-03 |
| Radio frequency circuit comprising at least one substrate with a conductively filled trench therein for electrically isolating a first circuit portion from a second circuit portion Grant 10,813,210 - Azadzoi , et al. October 20, 2 | 2020-10-20 |
| Additive manufacturing technology (AMT) inverted pad interface Grant 10,631,405 - Benedict , et al. | 2020-04-21 |
| Millimeter Wave Phased Array App 20200028257 - Benedict; James E. ; et al. | 2020-01-23 |
| Additive Manufactured Reactive Beamformer App 20190357363 - Sikina; Thomas V. ; et al. | 2019-11-21 |
| Thermally-enhanced And Deployable Structures App 20190315501 - Duong; Tuan L. ; et al. | 2019-10-17 |
| Thermally-enhanced And Deployable Structures App 20190315500 - Duong; Tuan L. ; et al. | 2019-10-17 |
| Additive Manufacturing Technology (amt) Low Profile Signal Divider App 20190269021 - Nufio-Molina; Jonathan E. ; et al. | 2019-08-29 |
| Snap-rf Interconnections App 20190269007 - Sikina; Thomas V. ; et al. | 2019-08-29 |
| Low Profile Phased Array App 20190148828 - Sikina; Thomas V. ; et al. | 2019-05-16 |
| Additive Manufacturing Technology (amt) Faraday Boundaries In Radio Frequency Circuits App 20190150271 - Azadzoi; Semira M. ; et al. | 2019-05-16 |
| Additive Manufacturing Technology Microwave Vertical Launch App 20190150296 - Southworth; Andrew R. ; et al. | 2019-05-16 |
| Spiral Antenna And Related Fabrication Techniques App 20190148832 - Adams; Peter J. ; et al. | 2019-05-16 |
| Additive Manufacturing Technology (amt) Low Profile Radiator App 20190148837 - Haven; John P. ; et al. | 2019-05-16 |
| Millimeter Wave Transmission Line Architecture App 20190148807 - Sikina; Thomas V. ; et al. | 2019-05-16 |
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