| Patent | Date |
|---|
Removable structure and removal method using the structure
Grant 11,424,156 - Landru , et al. August 23, 2 | 2022-08-23 |
System For Fracturing A Plurality Of Wafer Assemblies
App 20220181173 - Landru; Didier ; et al. | 2022-06-09 |
Method For Transferring A Useful Layer Onto A Support Substrate
App 20220172983 - Landru; Didier ; et al. | 2022-06-02 |
Method For Transferring A Useful Layer Onto A Support Substrate
App 20220157651 - Landru; Didier ; et al. | 2022-05-19 |
Method For Transferring A Use Ful Layer To A Carrier Substrate
App 20220157650 - Landru; Didier ; et al. | 2022-05-19 |
Process for smoothing the surface of a semiconductor-on-insulator substrate
Grant 11,276,605 - Kononchuk , et al. March 15, 2 | 2022-03-15 |
Holding Device For An Assembly That Is To Be Fractured
App 20220059370 - Landru; Didier ; et al. | 2022-02-24 |
Method For Manufacturing A Substrate For A Front-facing Image Sensor
App 20220059603 - Schwarzenbach; Walter ; et al. | 2022-02-24 |
Method for fabrication of a semiconductor structure including an interposer free from any through via
Grant 11,114,314 - Nguyen , et al. September 7, 2 | 2021-09-07 |
Substrates Including Useful Layers
App 20210202302 - Landru; Didier ; et al. | 2021-07-01 |
Method for transferring a useful layer
Grant 10,950,491 - Landru , et al. March 16, 2 | 2021-03-16 |
Removable Structure And Removal Method Using The Structure
App 20210050249 - Landru; Didier ; et al. | 2021-02-18 |
Method For Detecting The Splitting Of A Substrate Weakened By Implanting Atomic Species
App 20210028036 - Rieutord; Francois ; et al. | 2021-01-28 |
Method For Fabrication Of A Semiconductor Structure Including An Interposer Free From Any Through Via
App 20200328094 - Nguyen; Bich-Yen ; et al. | 2020-10-15 |
Process For Smoothing The Surface Of A Semiconductor-on-insulator Substrate
App 20190348319 - Kononchuk; Oleg ; et al. | 2019-11-14 |
Method For Transferring A Useful Layer
App 20190221471 - Landru; Didier ; et al. | 2019-07-18 |
Method for transferring a useful layer
Grant 9,922,867 - Landru , et al. March 20, 2 | 2018-03-20 |
Method for producing a composite structure
Grant 9,887,124 - Ben Mohamed , et al. February 6, 2 | 2018-02-06 |
Method for transferring a useful layer
Grant 9,589,830 - Landru , et al. March 7, 2 | 2017-03-07 |
Method For Producing A Composite Structure
App 20160372361 - Ben Mohamed; Nadia ; et al. | 2016-12-22 |
Method For Transferring A Layer From A Single-crystal Substrate
App 20160351438 - Ecarnot; Ludovic ; et al. | 2016-12-01 |
Method of implantation for fragilization of substrates
Grant 9,425,081 - Ben Mohamed , et al. August 23, 2 | 2016-08-23 |
Method For Transferring A Useful Layer
App 20160233125 - Landru; Didier ; et al. | 2016-08-11 |
Method For Transferring A Useful Layer
App 20150303098 - Landru; Didier ; et al. | 2015-10-22 |
Method For Reducing Surface Roughness While Producing A High Quality Useful Layer
App 20150221545 - Maleville; Christophe ; et al. | 2015-08-06 |
Method Of Implantation For Fragilization Of Substrates
App 20150050797 - Ben Mohamed; Nadia ; et al. | 2015-02-19 |
Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate
Grant 8,946,053 - Delprat , et al. February 3, 2 | 2015-02-03 |
Semiconductor On Glass Substrate With Stiffening Layer And Process Of Making The Same
App 20130130473 - Ben Mohamed; Nadia ; et al. | 2013-05-23 |
Method For Reducing Irregularities At The Surface Of A Layer Transferred From A Source Substrate To A Glass-based Support Substrate
App 20130071997 - Delprat; Daniel ; et al. | 2013-03-21 |
Method of bonding two substrates
Grant 8,349,703 - Kerdiles , et al. January 8, 2 | 2013-01-08 |
Controlled temperature implantation
Grant 8,247,309 - Cattet , et al. August 21, 2 | 2012-08-21 |
Semiconductor On Glass Substrate With Stiffening Layer And Process Of Making The Same
App 20120001293 - Ben Mohamed; Nadia ; et al. | 2012-01-05 |
Defectivity of post thin layer separation by modification of its separation annealing
Grant 8,088,671 - Schwarzenbach , et al. January 3, 2 | 2012-01-03 |
Controlled Temperature Implantation
App 20110312156 - Cattet; Sebastien ; et al. | 2011-12-22 |
Method of splitting a substrate
Grant 8,003,493 - Ben Mohamed , et al. August 23, 2 | 2011-08-23 |
Method Of Splitting A Substrate
App 20100176493 - Ben Mohamed; Nadia ; et al. | 2010-07-15 |
Methods for minimizing defects when transferring a semiconductor useful layer
Grant 7,749,862 - Schwarzenbach , et al. July 6, 2 | 2010-07-06 |
Defectivity Of Post Thin Layer Separation By Modification Of Its Separation Annealing
App 20100105217 - Schwarzenbach; Walter ; et al. | 2010-04-29 |
Method Of Bonding Two Substrates
App 20100093152 - Kerdiles; Sebastien ; et al. | 2010-04-15 |
Finishing process for the manufacture of a semiconductor structure
Grant 7,514,341 - Neyret , et al. April 7, 2 | 2009-04-07 |
Method of configuring a process to obtain a thin layer with a low density of holes
Grant 7,485,545 - Ben Mohamed , et al. February 3, 2 | 2009-02-03 |
Method of detaching a layer from a wafer using a localized starting area
Grant 7,465,645 - Schwarzenbach , et al. December 16, 2 | 2008-12-16 |
Thin layer transfer method utilizing co-implantation to reduce blister formation and to surface roughness
Grant 7,326,628 - Ben Mohamed , et al. February 5, 2 | 2008-02-05 |
Process for simplification of a finishing sequence and structure obtained thereby
App 20070148910 - Neyret; Eric ; et al. | 2007-06-28 |
Methods For Minimizing Defects When Transferring A Semiconductor Useful Layer
App 20070117229 - Schwarzenbach; Walter ; et al. | 2007-05-24 |
Method for producing a high quality useful layer on a substrate
App 20060223283 - Maleville; Christophe ; et al. | 2006-10-05 |
Method for producing a high quality useful layer on a substrate utilizing helium and hydrogen implantations
Grant 7,081,399 - Maleville , et al. July 25, 2 | 2006-07-25 |
Method of configuring a process to obtain a thin layer with a low density of holes
App 20060141755 - Ben Mohamed; Nadia ; et al. | 2006-06-29 |
Thin layer transfer method utilizing co-implantation to reduce blister formation and to surface roughness
App 20060060943 - Ben Mohamed; Nadia ; et al. | 2006-03-23 |
Method of detaching a layer from a wafer using a localized starting area
App 20050028727 - Schwarzenbach, Walter ; et al. | 2005-02-10 |
Method for producing a high quality useful layer on a substrate
App 20050026426 - Maleville, Christophe ; et al. | 2005-02-03 |
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