Belanger; Luc L.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Belanger; Luc L..The latest application filed is for "novel structure of ubm and solder bumps and methods of fabrication".
- Belanger; Luc L. - Quebec CA
| Patent | Date |
|---|---|
| Structure of UBM and solder bumps and methods of fabrication Grant 8,003,512 - Belanger , et al. August 23, 2 | 2011-08-23 |
| Novel Structure Of Ubm And Solder Bumps And Methods Of Fabrication App 20100193949 - Belanger; Luc L. ; et al. | 2010-08-05 |
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