Belanger; Luc

Patent Applications and Registrations

Patent applications and USPTO patent grants for Belanger; Luc.The latest application filed is for "managing adhesive curing for photonic system assembly".

Company Profile

1.6.11

Belanger; Luc - Quebec CA
Belanger; Luc - Laval CA
Belanger; Luc - Granby CA
Belanger; Luc - Canton de Granby CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Managing Adhesive Curing for Photonic System Assembly App 20220026637 - Asselin; Daniel ; et al.	2022-01-27
Light-emitting sign apparatus Grant 10,867,533 - Laforce , et al. December 15, 2	2020-12-15
Light-emitting Sign Apparatus App 20170301268 - LAFORCE; ROBERT ; et al.	2017-10-19
Interconnections for flip-chip using lead-free solders and having improved reaction barrier layers Grant 8,314,500 - Belanger , et al. November 20, 2	2012-11-20
Method Of Forming Underbump Metallurgy Structure Employing Sputter-deposited Nickel Copper Alloy App 20120202343 - Belanger; Luc ; et al.	2012-08-09
Injection molded soldering process and arrangement for three-dimensional structures Grant 7,952,205 - Belanger , et al. May 31, 2	2011-05-31
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers Grant 7,932,169 - Belanger , et al. April 26, 2	2011-04-26
Injection Molded Soldering Process And Arrangement For Three-dimensional Structures App 20100276813 - Belanger; Luc ; et al.	2010-11-04
Injection molded soldering process and arrangement for three-dimensional structures Grant 7,820,483 - Belanger , et al. October 26, 2	2010-10-26
Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers App 20100062597 - Belanger; Luc ; et al.	2010-03-11
Underbump Metallurgy Employing Sputter-deposited Nickel Titanium Alloy App 20090140423 - Belanger; Luc ; et al.	2009-06-04
Underbump Metallurgy Employing Sputter-deposited Nickel Titanium Copper Alloy App 20090134016 - Belanger; Luc ; et al.	2009-05-28
Injection Molded Soldering Process And Arrangement For Three-dimensional Structures App 20080185703 - Belanger; Luc ; et al.	2008-08-07
Interconnections For Flip-chip Using Lead-free Solders And Having Improved Reaction Barrier Layers App 20080157395 - Belanger; Luc ; et al.	2008-07-03
Fluxless solder transfer and reflow process Grant 7,332,424 - Belanger , et al. February 19, 2	2008-02-19
Fluxless solder transfer and reflow process App 20060035454 - Belanger; Luc ; et al.	2006-02-16
Injection molded continuously solidified solder method and apparatus App 20050263571 - Belanger, Luc ; et al.	2005-12-01

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