Beesley; Mark J.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Beesley; Mark J..The latest application filed is for "systems and methods for manufacturing thin substrate".
- Beesley; Mark J. - Carmel Valley CA
| Patent | Date |
|---|---|
| Electrical components attached to fabric Grant 11,388,817 - Sunshine , et al. July 12, 2 | 2022-07-12 |
| Systems And Methods For Manufacturing Thin Substrate App 20220104346 - Beesley; Mark J. ; et al. | 2022-03-31 |
| Three-Dimensional (3D) Copper in Printed Circuit Boards App 20220095455 - Mason; Anne M. ; et al. | 2022-03-24 |
| Electrical Components Attached to Fabric App 20210185808 - Sunshine; Daniel D. ; et al. | 2021-06-17 |
| Electrical components attached to fabric Grant 10,959,331 - Sunshine , et al. March 23, 2 | 2021-03-23 |
| Electrical Components Attached to Fabric App 20200329559 - Sunshine; Daniel D. ; et al. | 2020-10-15 |
| Electrical components attached to fabric Grant 10,701,802 - Sunshine , et al. | 2020-06-30 |
| Electrical Components Attached to Fabric App 20200084886 - Sunshine; Daniel D. ; et al. | 2020-03-12 |
| Electrical components attached to fabric Grant 10,485,103 - Sunshine , et al. Nov | 2019-11-19 |
| Connection pad for embedded components in PCB packaging Grant 10,455,707 - Kiplinger , et al. Oc | 2019-10-22 |
| Segmented via for vertical PCB interconnect Grant 10,420,213 - Beesley , et al. Sept | 2019-09-17 |
| Segmented Via For Vertical Pcb Interconnect App 20190075653 - Beesley; Mark J. ; et al. | 2019-03-07 |
| Fabric devices with shape memory alloy wires that provide haptic feedback Grant 10,191,550 - Nussbaum , et al. Ja | 2019-01-29 |
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