Bedner; David

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bedner; David.The latest application filed is for "lead-free solder paste as thermal interface material".

Company Profile

3.6.6

Bedner; David - Chandler AZ
Bedner; David - New Hartford NY
Bedner; David - Manchester NH US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
High Tg epoxy formulation with good thermal properties Grant 11,155,687 - Bedner , et al. October 26, 2	2021-10-26
Lead-free Solder Paste As Thermal Interface Material App 20200235033 - Lee; Ning-Cheng ; et al.	2020-07-23
High Tg Epoxy Formulation with Good Thermal Properties App 20200181342 - Bedner; David ; et al.	2020-06-11
High Tg epoxy formulation with good thermal properties Grant 10,364,332 - Bedner , et al.	2019-07-30
High Tg Epoxy Formulation with Good Thermal Properties App 20180251618 - Bedner; David ; et al.	2018-09-06
High Tg epoxy formulation with good thermal properties Grant 9,822,227 - Bedner , et al. November 21, 2	2017-11-21
High Tg Epoxy Formulation with Good Thermal Properties App 20160075839 - Bedner; David ; et al.	2016-03-17
Flame retardant compositions with a phosphorated compound Grant 8,697,864 - Bedner , et al. April 15, 2	2014-04-15
Flame Retardant Compositions With A Phosphorated Compound App 20120277347 - Bedner; David ; et al.	2012-11-01
Flame retardant compositions with a phosphorated compound Grant 8,129,456 - Bedner , et al. March 6, 2	2012-03-06
Flame retardant compositions with a phosphorated compound App 20060102882 - Bedner; David ; et al.	2006-05-18

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