Bedford Engineering Co.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Bedford Engineering Co..The latest application filed is for "envelope and enclosure sheet".
- Bedford Engineering Co. - Armonk NY
| Patent | Date |
|---|---|
| Envelope and enclosure sheet Grant 4,630,768 - Bradley December 23, 1 | 1986-12-23 |
| High speed method of making envelopes each with a double folded removable enclosure Grant 4,531,993 - Bradley July 30, 1 | 1985-07-30 |
| High speed method of making envelopes each with a separate enclosure Grant 4,530,731 - Bradley July 23, 1 | 1985-07-23 |
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