Beddingfield; Stanley Craig

Patent Applications and Registrations

Patent applications and USPTO patent grants for Beddingfield; Stanley Craig.The latest application filed is for "millimeter wave integrated circuit with ball grid array package including transmit and receive channels".

Company Profile

1.7.14

Beddingfield; Stanley Craig - Austin TX
Beddingfield; Stanley Craig - McKinney TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels Grant 10,262,957 - Murugan , et al.	2019-04-16
Millimeter Wave Integrated Circuit With Ball Grid Array Package Including Transmit And Receive Channels App 20180301428 - Murugan; Rajen Manicon ; et al.	2018-10-18
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels Grant 9,941,228 - Murugan , et al. April 10, 2	2018-04-10
Millimeter Wave Integrated Circuit With Ball Grid Array Package Including Transmit And Receive Channels App 20170229408 - MURUGAN; Rajen Manicon ; et al.	2017-08-10
Millimeter wave integrated circuit with ball grid array package including transmit and receive channels Grant 9,666,553 - Murugan , et al. May 30, 2	2017-05-30
Millimeter Wave Integrated Circuit With Ball Grid Array Package Including Transmit And Receive Channels App 20150364816 - MURUGAN; Rajen Manicon ; et al.	2015-12-17
Crack arrest vias for IC devices Grant 8,304,867 - McCarthy , et al. November 6, 2	2012-11-06
Crack Arrest Vias For Ic Devices App 20120104604 - McCarthy; Robert Fabian ; et al.	2012-05-03
System and Method for Improving Reliability of Integrated Circuit Packages App 20110204511 - BEDDINGFIELD; Stanley Craig ; et al.	2011-08-25
Semiconductor Wafer Chip Scale Package Test Flow And Dicing Process App 20110193200 - Lyne; Kevin P. ; et al.	2011-08-11
Integrated Circuit Package Having Integrated Faraday Shield App 20100214759 - BEDDINGFIELD; Stanley Craig ; et al.	2010-08-26
Integrated circuit package having integrated faraday shield Grant 7,741,567 - Beddingfield , et al. June 22, 2	2010-06-22
Environmental Die Seal Enhancement For Wafer Level Chip Scale Packages App 20100078769 - WEST; Jeffrey A. ; et al.	2010-04-01
Integrated Circuit Package Having Integrated Faraday Shield App 20090284947 - Beddingfield; Stanley Craig ; et al.	2009-11-19
Reliability Wcsp Layouts App 20090278263 - McCarthy; Robert Fabian ; et al.	2009-11-12
System and Method for Improving Reliability of Integrated Circuit Packages App 20090140401 - Beddingfield; Stanley Craig ; et al.	2009-06-04
Power plane design and jumper wire bond for voltage drop minimization App 20070029661 - Beddingfield; Stanley Craig ; et al.	2007-02-08
Dual BGA alloy structure for improved board-level reliability performance App 20070023910 - Beddingfield; Stanley Craig	2007-02-01
Fine pitch bumping with improved device standoff and bump volume Grant 6,372,622 - Tan , et al. April 16, 2	2002-04-16
Flip chip bump structure and method of making Grant 5,977,632 - Beddingfield November 2, 1	1999-11-02

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