Beckman; Michael W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Beckman; Michael W..The latest application filed is for "built up printed circuit boards".

Company Profile

0.4.7

Beckman; Michael W. - Portland OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Connecting a component with an embedded optical fiber Grant 7,373,068 - Mershon , et al. May 13, 2	2008-05-13
Apparatus and method for an embedded air dielectric for a package and a printed circuit board Grant 7,361,842 - Brist , et al. April 22, 2	2008-04-22
Electrical socket with compressible domed contacts Grant 7,234,947 - Alger , et al. June 26, 2	2007-06-26
Built up printed circuit boards App 20070037432 - Mershon; Jayne L. ; et al.	2007-02-15
Connecting A Component With An Embedded Optical Fiber App 20070025667 - Mershon; Jayne L. ; et al.	2007-02-01
Apparatus and method for an embedded air dielectric for a package and a printed circuit board App 20070000687 - Brist; Gary A. ; et al.	2007-01-04
Electrical socket with compressible domed contacts App 20060258184 - Alger; William O. ; et al.	2006-11-16
Electrical socket with compressible domed contacts Grant 7,121,841 - Alger , et al. October 17, 2	2006-10-17
Electrical socket with compressible domed contacts App 20060099835 - Alger; William O. ; et al.	2006-05-11
Methods for forming electrical connections and resulting devices App 20050208749 - Beckman, Michael W. ; et al.	2005-09-22
Optical fibers embedded in a printed circuit board App 20050063638 - Alger, William O. ; et al.	2005-03-24

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