| Patent | Date |
|---|
PCB with substrate integrated waveguides using multi-band monopole antenna feeds for high speed communication
Grant 11,399,428 - Roy Paladhi , et al. July 26, 2 | 2022-07-26 |
Pcb With Substrate Integrated Waveguides Using Multi-band Monopole Antenna Feeds For High Speed Communication
App 20210112655 - ROY PALADHI; Pavel ; et al. | 2021-04-15 |
VERTICALLY TRANSITIONING BETWEEN SUBSTRATE INTEGRATED WAVEGUIDES (SIWs) WITHIN A MULTILAYERED PRINTED CIRCUIT BOARD (PCB)
App 20210111472 - MYERS; JOSHUA C. ; et al. | 2021-04-15 |
Slack and strain control mechanism
Grant 10,257,599 - Becker , et al. | 2019-04-09 |
Structural dynamic heat sink
Grant 10,247,489 - Ahbel , et al. | 2019-04-02 |
Method for fabricating a hybrid land grid array connector
Grant 10,135,162 - Hejase , et al. November 20, 2 | 2018-11-20 |
Connector having a body with a conductive layer common to top and bottom surfaces of the body as well as to wall surfaces of a plurality of holes in the body
Grant 10,128,593 - Hejase , et al. November 13, 2 | 2018-11-13 |
Frequency-domain high-speed bus signal integrity compliance model
Grant 9,733,305 - Becker , et al. August 15, 2 | 2017-08-15 |
Structurally Dynamic Heat Sink
App 20170198985 - Ahbel; Bjorn J. ; et al. | 2017-07-13 |
Frequency-domain high-speed bus signal integrity compliance model
Grant 9,686,053 - Becker , et al. June 20, 2 | 2017-06-20 |
Frequency-domain high-speed bus signal integrity compliance model
Grant 9,673,941 - Becker , et al. June 6, 2 | 2017-06-06 |
Slack And Strain Control Mechanism
App 20170146153 - Becker; Wiren D. ; et al. | 2017-05-25 |
Structurally Dynamic Heat Sink
App 20170131045 - Ahbel; Bjorn J. ; et al. | 2017-05-11 |
Structurally Dynamic Heat Sink
App 20170131047 - Ahbel; Bjorn J. ; et al. | 2017-05-11 |
Structurally dynamic heat sink
Grant 9,644,907 - Ahbel , et al. May 9, 2 | 2017-05-09 |
Frequency-domain high-speed bus signal integrity compliance model
Grant 9,638,750 - Becker , et al. May 2, 2 | 2017-05-02 |
Structurally dynamic heat sink
Grant 9,625,220 - Ahbel , et al. April 18, 2 | 2017-04-18 |
DIMM connector region vias and routing
Grant 9,627,787 - Becker , et al. April 18, 2 | 2017-04-18 |
Dimm Connector Region Vias And Routing
App 20170062960 - Becker; Wiren D. ; et al. | 2017-03-02 |
DIMM connector region vias and routing
Grant 9,548,551 - Becker , et al. January 17, 2 | 2017-01-17 |
Frequency-domain High-speed Bus Signal Integrity Compliance Model
App 20160352473 - Becker; Wiren D. ; et al. | 2016-12-01 |
Frequency-domain High-speed Bus Signal Integrity Compliance Model
App 20160349319 - Becker; Wiren D. ; et al. | 2016-12-01 |
Frequency-domain High-speed Bus Signal Integrity Compliance Model
App 20160349325 - Becker; Wiren D. ; et al. | 2016-12-01 |
Frequency-domain High-speed Bus Signal Integrity Compliance Model
App 20160350195 - Becker; Wiren D. ; et al. | 2016-12-01 |
DIMM connector region vias and routing
Grant 9,444,162 - Becker , et al. September 13, 2 | 2016-09-13 |
Through-mesh-plane Vias In A Multi-layered Package
App 20150170996 - Altabella Lazzi; Dulce M. ; et al. | 2015-06-18 |
Multi-level Interconnect Apparatus
App 20130279103 - Becker; Wiren D. ; et al. | 2013-10-24 |
Method For Making High-speed Ceramic Modules With Hybrid Referencing Scheme For Improved Performance And Reduced Cost
App 20130252379 - Becker; Wiren D ; et al. | 2013-09-26 |
Method and apparatus for generating synchronization signals for synchronizing multiple chips in a system
Grant 8,295,419 - Hwang , et al. October 23, 2 | 2012-10-23 |
Self-healing chip-to-chip interface
Grant 8,050,174 - Becker , et al. November 1, 2 | 2011-11-01 |
Self-healing chip-to-chip interface
Grant 8,018,837 - Becker , et al. September 13, 2 | 2011-09-13 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Grant 7,985,927 - Becker , et al. July 26, 2 | 2011-07-26 |
High-Speed Ceramic Modules with Hybrid Referencing Scheme for Improved Performance and Reduced Cost
App 20110132650 - Becker; Wiren D. ; et al. | 2011-06-09 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Grant 7,897,879 - Becker , et al. March 1, 2 | 2011-03-01 |
Method and Apparatus for Generating Synchronization Signals for Synchronizing Multiple Chips in a System
App 20110033017 - Hwang; Charlie C. ; et al. | 2011-02-10 |
Method and apparatus for generating synchronization signals for synchronizing multiple chips in a system
Grant 7,826,579 - Hwang , et al. November 2, 2 | 2010-11-02 |
Circuit on a printed circuit board
Grant 7,742,315 - Becker , et al. June 22, 2 | 2010-06-22 |
Ceramic Substrate Grid Structure For The Creation Of Virtual Coax Arrangement
App 20090113703 - Becker; Wiren D. ; et al. | 2009-05-07 |
Ceramic Substrate Grid Structure For The Creation Of Virtual Coax Arrangement
App 20090108465 - Becker; Wiren D. ; et al. | 2009-04-30 |
Ceramic substrate grid structure for the creation of virtual coax arrangement
Grant 7,465,882 - Becker , et al. December 16, 2 | 2008-12-16 |
Ceramic Substrate Grid Structure For The Creation Of Virtual Coax Arrangement
App 20080142257 - Becker; Wiren D. ; et al. | 2008-06-19 |
Printed circuit board and chip module
Grant 7,355,125 - Becker , et al. April 8, 2 | 2008-04-08 |
Circuit on a printed circuit board
App 20070111576 - Becker; Wiren D. ; et al. | 2007-05-17 |
Printed circuit board and chip module
App 20070109726 - Becker; Wiren D. ; et al. | 2007-05-17 |
System for airflow management in electronic enclosures
Grant 7,113,401 - Becker , et al. September 26, 2 | 2006-09-26 |
Method and apparatus for generating synchronization signals for synchronizing multiple chips in a system
App 20060182212 - Hwang; Charlie C. ; et al. | 2006-08-17 |
System for airflow management in electronic enclosures
App 20060087813 - Becker; Wiren D. ; et al. | 2006-04-27 |
Apparatus and method for repairing electronic packages
Grant 6,713,686 - Becker , et al. March 30, 2 | 2004-03-30 |
Method for evaluating decoupling capacitor placement for VLSI chips
Grant 6,618,843 - Dansky , et al. September 9, 2 | 2003-09-09 |
Method for evaluating decoupling capacitor placement for VLSI chips
Grant 6,618,844 - Dansky , et al. September 9, 2 | 2003-09-09 |
Apparatus and method for repairing electronic packages
App 20030136581 - Becker, Wiren D. ; et al. | 2003-07-24 |
Application and test methodology for use with compression land grid array connectors
Grant 6,529,023 - Becker , et al. March 4, 2 | 2003-03-04 |
Application And Test Methodology For Use With Compression Land Grid Array Connectors
App 20020171442 - Becker, Wiren D. ; et al. | 2002-11-21 |
Method for evaluating decoupling capacitor placement for VLSI chips
App 20020040463 - Dansky, Allan H. ; et al. | 2002-04-04 |
Method for evaluating decoupling capacitor placement for VLSI chips
App 20020040467 - Dansky, Allan H. ; et al. | 2002-04-04 |
Early high level net based analysis of simultaneous switching
Grant 5,477,460 - Vakirtzis , et al. December 19, 1 | 1995-12-19 |
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