loadpatents
Patent applications and USPTO patent grants for Beaupre; Richard Alfred.The latest application filed is for "silicon carbide semiconductor devices, and methods for manufacturing thereof".
Patent | Date |
---|---|
Silicon Carbide Semiconductor Devices, And Methods For Manufacturing Thereof App 20150236151 - McMahon; James Jay ;   et al. | 2015-08-20 |
Cooling device for a power module, and a related method thereof Grant 8,982,558 - Beaupre , et al. March 17, 2 | 2015-03-17 |
Low cost manufacturing of micro-channel heatsink Grant 8,929,071 - Beaupre , et al. January 6, 2 | 2015-01-06 |
Circuit board including mask for controlling flow of solder Grant 8,853,550 - Gowda , et al. October 7, 2 | 2014-10-07 |
Busbar for power conversion applications Grant 8,772,634 - Beaupre , et al. July 8, 2 | 2014-07-08 |
Power converting apparatus having improved electro-thermal characteristics Grant 8,675,379 - Smolenski , et al. March 18, 2 | 2014-03-18 |
Flexible power connector Grant 8,622,754 - Delgado , et al. January 7, 2 | 2014-01-07 |
Method of forming semiconductor device package having high breakdown voltage and low parasitic inductance Grant 8,586,421 - Beaupre , et al. November 19, 2 | 2013-11-19 |
Coaxial power module Grant 8,487,416 - Delgado , et al. July 16, 2 | 2013-07-16 |
Power semiconductor module and fabrication method Grant 8,466,007 - Delgado , et al. June 18, 2 | 2013-06-18 |
Coaxial Power Module App 20130075878 - Delgado; Eladio Clemente ;   et al. | 2013-03-28 |
Power-converting Apparatus Having Improved Electro-thermal Characteristics App 20130039103 - SMOLENSKI; JOSEPH LUCIAN ;   et al. | 2013-02-14 |
Flexible Power Connector App 20130029531 - Delgado; Eladio Clemente ;   et al. | 2013-01-31 |
Double side cooled power module with power overlay Grant 8,358,000 - Beaupre , et al. January 22, 2 | 2013-01-22 |
Cooling Device For A Power Module, And A Related Method Thereof App 20120327603 - Beaupre; Richard Alfred ;   et al. | 2012-12-27 |
Semiconductor Device Package And Method Of Manufacturing Thereof App 20120329207 - Beaupre; Richard Alfred ;   et al. | 2012-12-27 |
Semiconductor device package having high breakdown voltage and low parasitic inductance and method of manufacturing thereof Grant 8,310,040 - Beaupre , et al. November 13, 2 | 2012-11-13 |
Busbar electrical power connector Grant 8,257,102 - Delgado , et al. September 4, 2 | 2012-09-04 |
Busbar For Power Conversion Applications App 20120217032 - Beaupre; Richard Alfred ;   et al. | 2012-08-30 |
Insulated metal substrates incorporating advanced cooling Grant 8,232,637 - Beaupre , et al. July 31, 2 | 2012-07-31 |
Semiconductor Device Package And Method Of Manufacturing Thereof App 20120146234 - Beaupre; Richard Alfred ;   et al. | 2012-06-14 |
Power Semiconductor Module And Fabrication Method App 20120009733 - Delgado; Eladio Clemente ;   et al. | 2012-01-12 |
Power module assembly with reduced inductance Grant 8,076,696 - Beaupre , et al. December 13, 2 | 2011-12-13 |
Busbar Electrical Power Connector App 20110300725 - Delgado; Eladio Clemente ;   et al. | 2011-12-08 |
Power semiconductor module and fabrication method Grant 8,049,338 - Delgado , et al. November 1, 2 | 2011-11-01 |
Circuit Board Including Mask For Controlling Flow Of Solder App 20110139495 - Gowda; Arun Virupaksha ;   et al. | 2011-06-16 |
Power Module Assembly With Reduced Inductance App 20110101515 - Beaupre; Richard Alfred ;   et al. | 2011-05-05 |
System and a method for controlling flow of solder Grant 7,919,714 - Gowda , et al. April 5, 2 | 2011-04-05 |
Gate drive circuitry for non-isolated gate semiconductor devices Grant 7,915,944 - Caiafa , et al. March 29, 2 | 2011-03-29 |
Methods for making millichannel substrate, and cooling device and apparatus using the substrate Grant 7,898,807 - Beaupre , et al. March 1, 2 | 2011-03-01 |
Heatsink And Method Of Fabricating Same App 20100302734 - Beaupre; Richard Alfred ;   et al. | 2010-12-02 |
Power semiconductor packaging method and structure Grant 7,829,386 - Fillion , et al. November 9, 2 | 2010-11-09 |
Insulated Metal Substrates Incorporating Advanced Cooling App 20100277868 - Beaupre; Richard Alfred ;   et al. | 2010-11-04 |
Gate Drive Circuitry For Non-isolated Gate Semiconductor Devices App 20100271081 - Caiafa; Antonio ;   et al. | 2010-10-28 |
Heat sink and cooling and packaging stack for press-packages Grant 7,817,422 - Gunturi , et al. October 19, 2 | 2010-10-19 |
Double Side Cooled Power Module With Power Overlay App 20100230800 - Beaupre; Richard Alfred ;   et al. | 2010-09-16 |
Methods For Making Millichannel Substrate, And Cooling Device And Apparatus Using The Substrate App 20100226093 - Beaupre; Richard Alfred ;   et al. | 2010-09-09 |
Millichannel Heat Sink, And Stack And Apparatus Using The Same App 20100175857 - Gerstler; William Dwight ;   et al. | 2010-07-15 |
Low cost anufacturing of micro-channel heatsink App 20100157526 - Beaupre; Richard Alfred ;   et al. | 2010-06-24 |
Heat Sink And Cooling And Packaging Stack For Press-packages App 20100038058 - Gunturi; Satish Sivarama ;   et al. | 2010-02-18 |
Advanced And Integrated Cooling For Press-packages App 20100038774 - Zhang; Richard S. ;   et al. | 2010-02-18 |
Photovoltaic integrated building component Grant 7,642,449 - Korman , et al. January 5, 2 | 2010-01-05 |
Power circuit package and fabrication method Grant 7,518,236 - Delgado , et al. April 14, 2 | 2009-04-14 |
Power Semiconductor Packaging Method And Structure App 20080305582 - Fillion; Raymond Albert ;   et al. | 2008-12-11 |
System And A Method For Controlling Flow Of Solder App 20080277456 - GOWDA; ARUN VIRUPAKSHA ;   et al. | 2008-11-13 |
Power Module With Laminar Interconnect App 20080054298 - Stevanovic; Ljubisa Dragoljub ;   et al. | 2008-03-06 |
System And Method For Current Sensing App 20080042636 - KOSTE; GLEN PETER ;   et al. | 2008-02-21 |
Power module, and phase leg assembly Grant 7,327,024 - Stevanovic , et al. February 5, 2 | 2008-02-05 |
Power Semiconductor Module And Fabrication Method App 20070235810 - Delgado; Eladio Clemente ;   et al. | 2007-10-11 |
Power semiconductor packaging method and structure Grant 7,262,444 - Fillion , et al. August 28, 2 | 2007-08-28 |
Power circuit package and fabrication method App 20070090464 - Delgado; Eladio Clemente ;   et al. | 2007-04-26 |
Power semiconductor packaging method and structure App 20070040186 - Fillion; Raymond Albert ;   et al. | 2007-02-22 |
Power module, phase leg, and three-phase inverter App 20060108684 - Stevanovic; Ljubisa Dragoljub ;   et al. | 2006-05-25 |
Photovoltaic Integrated Building Component App 20060042680 - Korman; Charles Steven ;   et al. | 2006-03-02 |
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