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Patent applications and USPTO patent grants for Beauchamp; Bruce.The latest application filed is for "connecting a plurality of bond pads and/or inner leads with a single bond wire".
Patent | Date |
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Connecting A Plurality Of Bond Pads And/or Inner Leads With A Single Bond Wire App 20080099893 - Beauchamp; Bruce ;   et al. | 2008-05-01 |
Connecting a plurality of bond pads and/or inner leads with a single bond wire Grant 7,326,594 - Beauchamp , et al. February 5, 2 | 2008-02-05 |
Connecting a Plurality of Bond Pads and/or Inner Leads With a Single Bond Wire App 20070215994 - Beauchamp; Bruce ;   et al. | 2007-09-20 |
Single die stitch bonding Grant 7,157,790 - Beauchamp , et al. January 2, 2 | 2007-01-02 |
Single die stitch bonding App 20040021192 - Beauchamp, Bruce ;   et al. | 2004-02-05 |
Split Common Source On Eeprom Array App 20020141239 - Beauchamp, Bruce ;   et al. | 2002-10-03 |
Split common source on EEPROM array Grant 6,459,616 - Beauchamp , et al. October 1, 2 | 2002-10-01 |
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