Bchir; Omar

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bchir; Omar.The latest application filed is for "panel level packaging for mems application".

Company Profile

0.12.13

Bchir; Omar - San Marcos CA
Bchir; Omar - San Diego CA US
Bchir; Omar - Phoenix AZ US
Bchir; Omar - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Panel level packaging for MEMS application Grant 10,150,667 - Pan , et al. Dec	2018-12-11
Panel Level Packaging For Mems Application App 20180230004 - PAN; Yaoling ; et al.	2018-08-16
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers Grant 9,929,097 - Nalla , et al. March 27, 2	2018-03-27
Dual epoxy dielectric and photosensitive solder mask coatings, and processes of making same Grant 9,398,699 - Jomaa , et al. July 19, 2	2016-07-19
Mechanical Adhesion Of Copper Metallization To Dielectric With Partially Cured Epoxy Fillers App 20160079174 - Nalla; Ravi ; et al.	2016-03-17
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers Grant 9,040,842 - Nalla , et al. May 26, 2	2015-05-26
Mechanical Adhesion Of Copper Metallization To Dielectric With Partially Cured Epoxy Fillers App 20130299226 - Nalla; Ravi ; et al.	2013-11-14
Mechanical adhesion of copper metallization to dielectric with partially cured epoxy fillers Grant 8,425,785 - Nalla , et al. April 23, 2	2013-04-23
Method of forming solder bumps on substrates Grant 8,252,677 - Bchir , et al. August 28, 2	2012-08-28
Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same Grant 8,163,830 - Bhimaraj , et al. April 24, 2	2012-04-24
Sacrificial Material to Facilitate Thin Die Attach App 20110233790 - Bchir; Omar	2011-09-29
Optical die structures and associated package substrates Grant 7,831,115 - Bchir , et al. November 9, 2	2010-11-09
Optical Die Structures And Associated Package Substrates App 20090238233 - Bchir; Omar ; et al.	2009-09-24
Removing dry film resist residues using hydrolyzable membranes Grant 7,538,021 - Jomaa , et al. May 26, 2	2009-05-26
Method Of Forming Solder Bumps On Substrates App 20090085206 - Bchir; Omar ; et al.	2009-04-02
Method Of Enabling Selective Area Plating On A Substrate App 20090081381 - Bchir; Omar ; et al.	2009-03-26
Printed Circuit Board And Method For Preparation Thereof App 20090056989 - Bchir; Omar ; et al.	2009-03-05
Methods For Electroless Plating Of Metal Traces On A Substrate And Devices And Systems Thereof App 20080160177 - Mataybas; J. C. ; et al.	2008-07-03
Removing dry film resist residues using hydrolyzable membranes App 20080070329 - Jomaa; Houssam ; et al.	2008-03-20
Nanoclays in polymer compositions, articles containing same, processes of making same, and systems containing same App 20070232741 - Bhimaraj; Praveen ; et al.	2007-10-04

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