loadpatents
Patent applications and USPTO patent grants for Bayot; Art.The latest application filed is for "method of mitigating voids during solder reflow".
Patent | Date |
---|---|
System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication Grant 7,100,813 - Bayot September 5, 2 | 2006-09-05 |
Method Of Mitigating Voids During Solder Reflow App 20060091184 - Bayot; Art ;   et al. | 2006-05-04 |
System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication App 20040149804 - Bayot, Art | 2004-08-05 |
System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication Grant 6,703,259 - Bayot March 9, 2 | 2004-03-09 |
System and method for achieving planar alignment of a substrate during solder ball mounting for use in semiconductor fabrication App 20030124765 - Bayot, Art | 2003-07-03 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.