| Patent | Date |
|---|
Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assemblies
Grant 11,410,961 - Bayless , et al. August 9, 2 | 2022-08-09 |
Methods and apparatus for protection of dielectric films during microelectronic component processing
Grant 11,289,360 - Bayless , et al. March 29, 2 | 2022-03-29 |
Package cooling by coil cavity
Grant 11,239,129 - Bayless , et al. February 1, 2 | 2022-02-01 |
Method For Semiconductor Die Edge Protection And Semiconductor Die Separation
App 20220013401 - Wirz; Brandon P. ; et al. | 2022-01-13 |
Separation Method And Assembly For Chip-on-wafer Processing
App 20210391316 - Bayless; Andrew M. ; et al. | 2021-12-16 |
Methods And Apparatus For Temperature Modification And Reduction Of Contamination In Bonding Stacked Microelectronic Devices
App 20210384042 - Qu; Xiaopeng ; et al. | 2021-12-09 |
Methods and apparatus for wafer handling and processing
Grant 11,195,740 - Bayless , et al. December 7, 2 | 2021-12-07 |
Methods for reducing heat transfer in semiconductor assemblies, and associated systems and devices
Grant 11,189,609 - Wirz , et al. November 30, 2 | 2021-11-30 |
Processes for adjusting dimensions of dielectric bond line materials and related films, articles and assemblies
Grant 11,189,590 - Bayless , et al. November 30, 2 | 2021-11-30 |
Methods For Reducing Heat Transfer In Semiconductor Assemblies, And Associated Systems And Devices
App 20210343692 - Wirz; Brandon P. ; et al. | 2021-11-04 |
Methods And Apparatus For Temperature Modification In Bonding Stacked Microelectronic Components And Related Substrates And Assemblies
App 20210296192 - Bayless; Andrew M. ; et al. | 2021-09-23 |
Disposing Protective Cover Film And Underfill Layer Over Singulated Integrated Circuit Dice For Protection During Integrated Circuit Processing
App 20210272846 - Bayless; Andrew M. ; et al. | 2021-09-02 |
Methods And Apparatus For Protection Of Dielectric Films During Microelectronic Component Processing
App 20210183682 - Bayless; Andrew M. ; et al. | 2021-06-17 |
Processes For Adjusting Dimensions Of Dielectric Bond Line Materials And Related Films, Articles And Assemblies
App 20210183806 - Bayless; Andrew M. ; et al. | 2021-06-17 |
Reconstructed Wafer To Wafer Bonding Using A Permanent Bond With Laser Release
App 20210183803 - Bayless; Andrew M. | 2021-06-17 |
Thin Die Release For Semiconductor Device Assembly
App 20210183702 - Bayless; Andrew M. ; et al. | 2021-06-17 |
Methods and systems for manufacturing semiconductor devices
Grant 10,971,471 - Bayless , et al. April 6, 2 | 2021-04-06 |
Package Cooling By Coil Cavity
App 20200395258 - Bayless; Andrew M. ; et al. | 2020-12-17 |
Carrier removal by use of multilayer foil
Grant 10,861,765 - Derderian , et al. December 8, 2 | 2020-12-08 |
Methods And Apparatus For Wafer Handling And Processing
App 20200335379 - Bayless; Andrew M. ; et al. | 2020-10-22 |
Bond chucks having individually-controllable regions, and associated systems and methods
Grant 10,770,421 - Bayless , et al. Sep | 2020-09-08 |
Bond chucks having individually-controllable regions, and associated systems and methods
Grant 10,770,422 - Bayless , et al. Sep | 2020-09-08 |
Package cooling by coil cavity
Grant 10,763,186 - Bayless , et al. Sep | 2020-09-01 |
Apparatus for processing device structures
Grant 10,749,071 - Bayless A | 2020-08-18 |
Bond Chucks Having Individually-controllable Regions, And Associated Systems And Methods
App 20200212002 - Bayless; Andrew M. ; et al. | 2020-07-02 |
Package Cooling By Coil Cavity
App 20200211916 - Bayless; Andrew M. ; et al. | 2020-07-02 |
Bond Chucks Having Individually-controllable Regions, And Associated Systems And Methods
App 20200212003 - Bayless; Andrew M. ; et al. | 2020-07-02 |
Methods And Systems For Manufacturing Semiconductor Devices
App 20200212001 - Bayless; Andrew M. ; et al. | 2020-07-02 |
Systems enabling lower-stress processing of semiconductor device structures and related structures
Grant 10,679,967 - Bayless , et al. | 2020-06-09 |
Methods for processing semiconductor dice and fabricating assemblies incorporating same
Grant 10,559,495 - Bayless , et al. Feb | 2020-02-11 |
Carrier Removal By Use of Multilayer Foil
App 20190341325 - Derderian; James M. ; et al. | 2019-11-07 |
Carrier removal by use of multilayer foil
Grant 10,431,519 - Derderian , et al. O | 2019-10-01 |
Methods and system for processing semiconductor device structures
Grant 10,403,598 - Bayless , et al. Sep | 2019-09-03 |
Method And Apparatus For Processing Semiconductor Device Structures
App 20190252575 - Bayless; Andrew M. | 2019-08-15 |
Methods For Processing Semiconductor Dice And Fabricating Assemblies Incorporating Same
App 20190198388 - Bayless; Andrew M. ; et al. | 2019-06-27 |
Method and apparatus for processing semiconductor device structures
Grant 10,326,044 - Bayless | 2019-06-18 |
Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures
Grant 10,325,926 - Tang , et al. | 2019-06-18 |
Systems Enabling Lower-stress Processing Of Semiconductor Device Structures And Related Structures
App 20190148335 - Bayless; Andrew M. ; et al. | 2019-05-16 |
Method And Apparatus For Processing Semiconductor Device Structures
App 20190057901 - Bayless; Andrew M. | 2019-02-21 |
Methods And System For Processing Semiconductor Device Structures
App 20190051630 - Bayless; Andrew M. ; et al. | 2019-02-14 |
Methods for processing semiconductor dice and fabricating assemblies incorporating same
Grant 10,163,693 - Bayless , et al. Dec | 2018-12-25 |
Methods for temporarily bonding a device wafer to a carrier wafer, and related assemblies
Grant 9,716,023 - Farrens , et al. July 25, 2 | 2017-07-25 |
Semiconductor-Metal-On-Insulator Structures, Methods of Forming Such Structures, and Semiconductor Devices Including Such Structures
App 20170194351 - Tang; Sanh D. ; et al. | 2017-07-06 |
Semiconductor-metal-on-insulator structures, methods of forming such structures, and semiconductor devices including such structures
Grant 9,608,119 - Tang , et al. March 28, 2 | 2017-03-28 |
Methods For Temporarily Bonding A Device Wafer To A Carrier Wafer, And Related Assemblies
App 20160020129 - Farrens; Sharon N. ; et al. | 2016-01-21 |
Semiconductor-metal-on-insulator Structures, Methods Of Forming Such Structures, And Semiconductor Devices Including Such Structures
App 20110215407 - Tang; Sanh D. ; et al. | 2011-09-08 |
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