BAYES; Martin W.
Patent Applications and Registrations
Patent applications and USPTO patent grants for BAYES; Martin W..The latest application filed is for "printable non-curable thixotropic hot melt composition".
- BAYES; Martin W. - Hopkinton MA
| Patent | Date |
|---|---|
| Printable Non-Curable Thixotropic Hot Melt Composition App 20220306884 - WANG; Lei ; et al. | 2022-09-29 |
| Printable Non-curable Thixotropic Hot Melt Composition App 20220306883 - Wang; Lei ; et al. | 2022-09-29 |
| Enhanced Performance Ultraconductive Copper And Process Of Making App 20200294684 - BAYES; Martin W. ; et al. | 2020-09-17 |
| Metallic Structure With Desired Combinations Of Mechanical And Electrical Characteristics App 20200294685 - BAYES; Martin W. ; et al. | 2020-09-17 |
| Use Of Enhanced Performance Ultraconductive Copper Materials In Cylindrical Configurations And Methods Of Forming Ultraconductive Copper Materials App 20200295427 - BAYES; Martin W. ; et al. | 2020-09-17 |
| Method for electroless metallization Grant 9,863,044 - Rzeznik , et al. January 9, 2 | 2018-01-09 |
| Process for electroless plating and a solution used for the same Grant 9,783,890 - Yee , et al. October 10, 2 | 2017-10-10 |
| Process for electroless plating and a solution used for the same Grant 9,499,910 - Yee , et al. November 22, 2 | 2016-11-22 |
| Electrochemically deposited indium composites Grant 9,228,092 - Brese , et al. January 5, 2 | 2016-01-05 |
| Process For Electroless Plating And A Solution Used For The Same App 20150322574 - YEE; Dennis Kwok-Wai ; et al. | 2015-11-12 |
| Methods and compositions for removal of metal hardmasks Grant 9,102,901 - Wang , et al. August 11, 2 | 2015-08-11 |
| Organic solderability preservative and method Grant 8,961,678 - Tang , et al. February 24, 2 | 2015-02-24 |
| Organic Solderability Preservative And Method App 20140174322 - TANG; Qin ; et al. | 2014-06-26 |
| Methods And Compositions For Removal Of Metal Hardmasks App 20140179582 - Wang; Deyan ; et al. | 2014-06-26 |
| Process For Electroless Plating And A Solution Used For The Same App 20140120263 - YEE; Dennis Kwok-Wai ; et al. | 2014-05-01 |
| Method For Electroless Metallization App 20140093647 - RZEZNIK; Maria Anna ; et al. | 2014-04-03 |
| Electrochemically Deposited Indium Composites App 20140070399 - BRESE; Nathaniel E. ; et al. | 2014-03-13 |
| Electrochemically deposited indium composites Grant 8,585,885 - Brese , et al. November 19, 2 | 2013-11-19 |
| Electrochemically deposited indium composites App 20090075102 - Brese; Nathaniel E. ; et al. | 2009-03-19 |
| Cleaning composition App 20050261152 - Carter, John G. ; et al. | 2005-11-24 |
| Method of measuring component loss App 20040258847 - Bayes, Martin W. ; et al. | 2004-12-23 |
| Cleaning composition App 20040112869 - Carter, John G. ; et al. | 2004-06-17 |
| Treating metal surfaces with a modified oxide replacement composition App 20040101624 - Bayes, Martin W. | 2004-05-27 |
| Process of producing printed circuit boards and the circuit boards formed thereby App 20040084399 - Cook, Lee M. ; et al. | 2004-05-06 |
| Seed layer repair bath Grant 6,660,153 - Merricks , et al. December 9, 2 | 2003-12-09 |
| Seed layer Grant 6,660,154 - Merricks , et al. December 9, 2 | 2003-12-09 |
| Electrochemical co-deposition of metals for electronic device manufacture App 20020127847 - Alling, Eric R. ; et al. | 2002-09-12 |
| Seed layer repair bath App 20020088713 - Merricks, David ; et al. | 2002-07-11 |
| Plating bath App 20020090484 - Merricks, David ; et al. | 2002-07-11 |
| Seed layer App 20020084193 - Merricks, David ; et al. | 2002-07-04 |
| Seed layer repair method App 20020000382 - Morrissey, Denis ; et al. | 2002-01-03 |
| Composition for circuit board manufacture Grant 6,261,466 - Bayes , et al. July 17, 2 | 2001-07-17 |
| Methods for manufacture of electronic devices Grant 6,139,762 - Esposito , et al. October 31, 2 | 2000-10-31 |
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