loadpatents
name:-0.0066449642181396
name:-0.014839887619019
name:-0.00046181678771973
Baumann; Helmut Patent Filings

Baumann; Helmut

Patent Applications and Registrations

Patent applications and USPTO patent grants for Baumann; Helmut.The latest application filed is for "micromechanical capacitive sensor element".

Company Profile
0.12.5
  • Baumann; Helmut - Gomaringen DE
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Device made of single-crystal silicon
Grant 8,298,962 - Kaelberer , et al. October 30, 2
2012-10-30
Micromechanical Capacitive Sensor Element
App 20110108932 - Benzel; Hubert ;   et al.
2011-05-12
Device Made Of Single-crystal Silicon
App 20110014794 - KAELBERER; Arnd ;   et al.
2011-01-20
Device made of single-crystal silicon
Grant 7,834,452 - Kaelberer , et al. November 16, 2
2010-11-16
Device made of single-crystal silicon
App 20090008749 - Kaelberer; Arnd ;   et al.
2009-01-08
Sensor with at least one micromechanical structure, and method for producing it
Grant 7,273,764 - Reichenbach , et al. September 25, 2
2007-09-25
Sensor with at least one micromechanical structure, and method for producing it
App 20050230708 - Reichenbach, Frank ;   et al.
2005-10-20
Sensor with at least one micromechanical structure and method for production thereof
Grant 6,936,902 - Reichenbach , et al. August 30, 2
2005-08-30
Method of producing structured wafers
Grant 6,723,250 - Schaefer , et al. April 20, 2
2004-04-20
Sensor with at least one micromechanical structure and method for production thereof
App 20040065932 - Reichenbach, Frank ;   et al.
2004-04-08
Wafer stack and method of producing sensors
Grant 6,106,735 - Kurle , et al. August 22, 2
2000-08-22
Angular velocity sensor with built-in limit stops
Grant 5,721,377 - Kurle , et al. February 24, 1
1998-02-24
Mass flow sensor
Grant 5,705,745 - Treutler , et al. January 6, 1
1998-01-06
Method for producing a component according to the anodic bonding method and component
Grant 5,683,947 - Baumann November 4, 1
1997-11-04
Semiconductor sensor having a protective layer
Grant 5,629,538 - Lipphardt , et al. May 13, 1
1997-05-13
Acceleration sensor
Grant 5,461,917 - Marek , et al. October 31, 1
1995-10-31
Method of assembling micromechanical sensors
Grant 5,273,939 - Becker , et al. December 28, 1
1993-12-28

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