loadpatents
Patent applications and USPTO patent grants for Bauer; Tomas.The latest application filed is for "method of making a semiconductor device having a functional capping".
Patent | Date |
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Method of making a semiconductor device having a functional capping Grant 9,620,390 - Ebefors , et al. April 11, 2 | 2017-04-11 |
Method of making a semiconductor device having a functional capping Grant 9,362,139 - Ebefors , et al. June 7, 2 | 2016-06-07 |
Method Of Making A Semiconductor Device Having A Functional Capping App 20160122180 - Ebefors; Thorbjom ;   et al. | 2016-05-05 |
Methods for making a starting substrate wafer for semiconductor engineering having wafer through connections Grant 9,312,217 - Kalvesten , et al. April 12, 2 | 2016-04-12 |
Barrier structure Grant 8,598,676 - Ebefors , et al. December 3, 2 | 2013-12-03 |
Vias and method of making Grant 8,324,103 - Bauer December 4, 2 | 2012-12-04 |
Barrier Structure App 20120292736 - Ebefors; Thorbjorn ;   et al. | 2012-11-22 |
Functional Capping App 20120267773 - Ebefors; Thorbjorn ;   et al. | 2012-10-25 |
Micropackaging Method And Devices App 20100053922 - Ebefors; Thorbjorn ;   et al. | 2010-03-04 |
Vias And Method Of Making App 20100052107 - Bauer; Tomas | 2010-03-04 |
Trench Isolation For Reduced Cross Talk App 20090302414 - Ebefors; Thorbjorn ;   et al. | 2009-12-10 |
Methods For Making A Starting Substrate Wafer For Semiconductor Engineering Having Wafer Through Connections App 20090195948 - Kalvesten; Edvard ;   et al. | 2009-08-06 |
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