Batz; Robert W. JR.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Batz; Robert W. JR..The latest application filed is for "apparatus and method for thermally controlled processing of microelectronic workpieces".

Company Profile

0.0.19

Batz; Robert W. JR. - Kalispell MT
Batz, Robert W. JR. - City of Kalispell MT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Apparatus and Method for Thermally Controlled Processing of Microelectronic Workpieces App 20080011450 - Hanson; Kyle M. ; et al.	2008-01-17
Electrolytic copper process using anion permeable barrier App 20070068820 - Baskaran; Rajesh ; et al.	2007-03-29
Copper electrolytic process using cation permeable barrier App 20060260946 - Baskaran; Rajesh ; et al.	2006-11-23
Electrolytic process using cation permeable barrier App 20060237323 - Baskaran; Rajesh ; et al.	2006-10-26
Method for applying metal features onto barrier layers using ion permeable barriers App 20060189129 - Baskaran; Rajesh ; et al.	2006-08-24
Electrolytic process using anion permeable barrier App 20060163072 - Baskaran; Rajesh ; et al.	2006-07-27
Electrolytic process using anion permeable barrier App 20060157355 - Baskaran; Rajesh ; et al.	2006-07-20
Method and apparatus for processing a microfeature workpiece with multiple fluid streams App 20050205111 - Ritzdorf, Thomas L. ; et al.	2005-09-22
Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density App 20050051436 - Chen, Linlin ; et al.	2005-03-10
Electroplating reactor including back-side electrical contact apparatus App 20040222086 - Woodruff, Daniel J. ; et al.	2004-11-11
Methods for plating semiconductor workpieces using a workpiece-engaging electrode assembly with sealing boot App 20040035707 - Batz, Robert W. JR. ; et al.	2004-02-26
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces App 20040035694 - Batz, Robert W. JR. ; et al.	2004-02-26
Apparatus and method for thermally controlled processing of microelectronic workpieces App 20040013808 - Hanson, Kyle M. ; et al.	2004-01-22
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces App 20030196892 - Batz, Robert W. JR. ; et al.	2003-10-23
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces App 20030173209 - Batz, Robert W. JR. ; et al.	2003-09-18
Method for filling recessed micro-structures with metallization in the production of a microelectronic device App 20030045095 - Ritzdorf, Thomas L. ; et al.	2003-03-06
Submicron metallization using electrochemical deposition App 20020004301 - Chen, Linlin ; et al.	2002-01-10
Method, chemistry, and apparatus for high deposition rate solder electroplating on a microelectronic workpiece App 20020000378 - Batz,, Robert W. JR. ; et al.	2002-01-03
Electroplating reactor including back-side electrical contact apparatus App 20010052457 - Woodruff, Daniel J. ; et al.	2001-12-20

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