Batz, Jr.; Robert W.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Batz, Jr.; Robert W..The latest application filed is for "electrolytic copper process using anion permeable barrier".

Company Profile

1.19.6

Batz, Jr.; Robert W. - Kalispell MT
Batz, Jr.; Robert W - Kalispell MT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electroplating tool with feedback of metal thickness distribution and correction Grant 10,260,855 - Egan , et al.	2019-04-16
Electrolytic copper process using anion permeable barrier Grant 9,234,293 - Baskaran , et al. January 12, 2	2016-01-12
Electrolytic Copper Process Using Anion Permeable Barrier App 20150083600 - Baskaran; Rajesh ; et al.	2015-03-26
Electrolytic process using cation permeable barrier Grant 8,961,771 - Baskaran , et al. February 24, 2	2015-02-24
Electroplating Tool With Feedback Of Metal Thickness Distribution And Correction App 20140367267 - Egan; Todd J. ; et al.	2014-12-18
Electrolytic process using anion permeable barrier Grant 8,852,417 - Baskaran , et al. October 7, 2	2014-10-07
Methods For Electrochemical Deposition Of Multi-component Solder Using Cation Permeable Barrier App 20140246324 - Baskaran; Rajesh ; et al.	2014-09-04
Electrolytic Process Using Cation Permeable Barrier App 20140209472 - Baskaran; Rajesh ; et al.	2014-07-31
Electrolytic Process Using Cation Permeable Barrier App 20120292194 - Baskaran; Rajesh ; et al.	2012-11-22
Electrolytic process using cation permeable barrier Grant 8,236,159 - Baskaran , et al. August 7, 2	2012-08-07
Electrolytic Copper Process Using Anion Permeable Barrier App 20120152751 - Baskaran; Rajesh ; et al.	2012-06-21
Electrolytic copper process using anion permeable barrier Grant 8,123,926 - Baskaran , et al. February 28, 2	2012-02-28
Apparatus and method for thermally controlled processing of microelectronic workpieces Grant 7,252,714 - Hanson , et al. August 7, 2	2007-08-07
Method of submicron metallization using electrochemical deposition of recesses including a first deposition at a first current density and a second deposition at an increased current density Grant 7,144,805 - Chen , et al. December 5, 2	2006-12-05
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces Grant 7,048,841 - Batz, Jr. , et al. May 23, 2	2006-05-23
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces Grant 6,939,448 - Batz, Jr. , et al. September 6, 2	2005-09-06
Contact assemblies, methods for making contact assemblies, and plating machines with contact assemblies for plating microelectronic workpieces Grant 6,911,127 - Batz, Jr. , et al. June 28, 2	2005-06-28
Electroplating reactor including back-side electrical contact apparatus Grant 6,849,167 - Woodruff , et al. February 1, 2	2005-02-01
Contact assembly for supplying power to workpieces during electrochemical processing Grant 6,805,778 - Batz, Jr. , et al. October 19, 2	2004-10-19
Submicron metallization using electrochemical deposition Grant 6,806,186 - Chen , et al. October 19, 2	2004-10-19
Method for high deposition rate solder electroplating on a microelectronic workpiece Grant 6,669,834 - Batz, Jr. , et al. December 30, 2	2003-12-30
Apparatus and methods for controlling workpiece surface exposure to processing liquids during the fabrication of microelectronic components Grant 6,602,383 - Batz, Jr. , et al. August 5, 2	2003-08-05
Methods for controlling semiconductor workpiece surface exposure to processing liquids Grant 6,090,711 - Batz, Jr. , et al. July 18, 2	2000-07-18

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