Batinovich; Victor
Patent Applications and Registrations
Patent applications and USPTO patent grants for Batinovich; Victor.The latest application filed is for "method for low-cost redistribution and under-bump metallization for flip-chip and wafer-level bga silicon device packages".
- Batinovich; Victor - Sunnyvale CA
- Batinovich, Victor - San Martin CA
- Batinovich; Victor - Morgan Hill CA
| Patent | Date |
|---|---|
| Method and apparatus for memory module circuit interconnection Grant 7,104,804 - Batinovich September 12, 2 | 2006-09-12 |
| Method for low-cost redistribution and under-bump metallization for flip-chip and wafer-level BGA silicon device packages App 20040040855 - Batinovich, Victor | 2004-03-04 |
| Method and apparatus for vertically stacking and interconnecting ball grid array (BGA) electronic circuit devices App 20020061665 - Batinovich, Victor | 2002-05-23 |
| Method and apparatus for memory module circuit interconnection App 20020015340 - Batinovich, Victor | 2002-02-07 |
| Metal semiconductor package with an external plastic seal Grant 5,491,110 - Fehr , et al. February 13, 1 | 1996-02-13 |
| Metal semiconductor package with an external plastic seal Grant 5,436,407 - Fehr , et al. July 25, 1 | 1995-07-25 |
| SEC | 0001032649 | BATINOVICH VICTOR |
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