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Electrochemical processing of conductive surface
Grant 7,572,354 - Uzoh , et al. August 11, 2 | 2009-08-11 |
Plating by creating a differential between additives disposed on a surface portion and a cavity portion of a workpiece
Grant 7,404,886 - Basol July 29, 2 | 2008-07-29 |
Pad designs and structures for a versatile materials processing apparatus
Grant 7,378,004 - Uzoh , et al. May 27, 2 | 2008-05-27 |
Method and apparatus for forming an electrical contact with a semiconductor substrate
Grant 7,309,407 - Talieh , et al. December 18, 2 | 2007-12-18 |
Method of depositing materials on full face of a wafer
App 20070141818 - Basol; Bulent | 2007-06-21 |
Chip interconnect and packaging deposition methods and structures
Grant 7,147,766 - Uzoh , et al. December 12, 2 | 2006-12-12 |
Apparatus with conductive pad for electroprocessing
App 20060219573 - Uzoh; Cyprian Emeka ; et al. | 2006-10-05 |
Plating method that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
App 20060207885 - Basol; Bulent | 2006-09-21 |
Chip interconnect and packaging deposition methods and structures
App 20060070885 - Uzoh; Cyprian Emeka ; et al. | 2006-04-06 |
Method and apparatus for forming an electrical contact with a semiconductor substrate
App 20060042934 - Talieh; Homayoun ; et al. | 2006-03-02 |
Apparatus of sealing wafer backside for full-face processing
Grant 6,988,932 - Ashjaee , et al. January 24, 2 | 2006-01-24 |
Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
App 20050279641 - Basol, Bulent | 2005-12-22 |
Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization
Grant 6,974,769 - Basol , et al. December 13, 2 | 2005-12-13 |
Method and apparatus for forming an electrical contact with a semiconductor substrate
Grant 6,958,114 - Talieh , et al. October 25, 2 | 2005-10-25 |
Packaging deposition methods
Grant 6,905,588 - Uzoh , et al. June 14, 2 | 2005-06-14 |
Method of sealing wafer backside for full-face electrochemical plating
Grant 6,855,037 - Ashjaee , et al. February 15, 2 | 2005-02-15 |
Method of sealing wafer backside for full-face processing
App 20040166789 - Ashjaee, Jalal ; et al. | 2004-08-26 |
Workpiece proximity etching method and apparatus
App 20040134793 - Uzoh, Cyprian Emeka ; et al. | 2004-07-15 |
Conductive structure fabrication process using novel layered structure and conductive structure fabricated thereby for use in multi-level metallization
App 20040052930 - Basol, Bulent ; et al. | 2004-03-18 |
Semiconductor workpiece proximity plating methods and apparatus
Grant 6,666,959 - Uzoh , et al. December 23, 2 | 2003-12-23 |
Chemical mechanical polishing endpoint detection
App 20030213558 - Basol, Bulent ; et al. | 2003-11-20 |
Workpeice proximity plating apparatus
Grant 6,630,059 - Uzoh , et al. October 7, 2 | 2003-10-07 |
Chip interconnect and pacaging deposition methods and structures
App 20030164302 - Uzoh, Cyprian Emeka ; et al. | 2003-09-04 |
Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
App 20030146089 - Basol, Bulent | 2003-08-07 |
Chemical Mechanical Polishing Endpoint Detection
App 20030073319 - Basol, Bulent ; et al. | 2003-04-17 |
Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
Grant 6,534,116 - Basol March 18, 2 | 2003-03-18 |
Method for forming an electrical contact with a semiconductor substrate
Grant 6,471,847 - Talieh , et al. October 29, 2 | 2002-10-29 |
Pad designs and structures for a versatile materials processing apparatus
App 20020130034 - Uzoh, Cyprian ; et al. | 2002-09-19 |
Method of sealing wafer backside for full-face electrochemical plating
App 20020127956 - Ashjaee, Jalal ; et al. | 2002-09-12 |
Method and apparatus for forming an electrical contact with a semiconductor substrate
App 20020088715 - Talieh, Homayoun ; et al. | 2002-07-11 |
Method and apparatus employing pad designs and structures with improved fluid distribution
Grant 6,413,403 - Lindquist , et al. July 2, 2 | 2002-07-02 |
Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
App 20020074230 - Basol, Bulent | 2002-06-20 |
Modified plating solution for plating and planarization and process utilizing same
App 20020061715 - Uzoh, Cyprian ; et al. | 2002-05-23 |
Packaging deposition methods
App 20020033342 - Uzoh, Cyprian Emeka ; et al. | 2002-03-21 |
Method for forming an electrical contact with a semiconductor substrate
App 20020029978 - Talieh, Homayoun ; et al. | 2002-03-14 |
Modified plating solution for plating and planarization and process utilizing same
Grant 6,354,916 - Uzoh , et al. March 12, 2 | 2002-03-12 |
Semiconductor workpiece proximity plating apparatus
App 20020020621 - Uzoh, Cyprian Emeka ; et al. | 2002-02-21 |
Apparatus for forming an electrical contact with a semiconductor substrate
Grant 6,251,235 - Talieh , et al. June 26, 2 | 2001-06-26 |
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