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name:-0.039741039276123
name:-0.01407790184021
name:-0.0046210289001465
Baskaran; Rajesh Patent Filings

Baskaran; Rajesh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Baskaran; Rajesh.The latest application filed is for "fet operational temperature determination by gate structure resistance thermometry".

Company Profile
5.15.27
  • Baskaran; Rajesh - Dracut MA
  • Baskaran; Rajesh - Kalispell MT US
  • Baskaran; Rajesh - Nashua NH US
  • Baskaran; Rajesh - Santa Clara CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
FET operational temperature determination by field plate resistance thermometry
Grant 10,855,230 - Mahon , et al. December 1, 2
2020-12-01
FET operational temperature determination by gate structure resistance thermometry
Grant 10,790,787 - Mahon , et al. September 29, 2
2020-09-29
Fet Operational Temperature Determination By Field Plate Resistance Thermometry
App 20200144969 - Mahon; Simon John ;   et al.
2020-05-07
Fet Operational Temperature Determination By Gate Structure Resistance Thermometry
App 20200144970 - Mahon; Simon John ;   et al.
2020-05-07
Barrier For Preventing Eutectic Break-through In Through-substrate Vias
App 20190096743 - Hanson; Allen W. ;   et al.
2019-03-28
Barrier for preventing eutectic break-through in through-substrate vias
Grant 10,147,642 - Hanson , et al. De
2018-12-04
Electrolytic copper process using anion permeable barrier
Grant 9,234,293 - Baskaran , et al. January 12, 2
2016-01-12
Electrolytic Copper Process Using Anion Permeable Barrier
App 20150083600 - Baskaran; Rajesh ;   et al.
2015-03-26
Electrolytic process using cation permeable barrier
Grant 8,961,771 - Baskaran , et al. February 24, 2
2015-02-24
Interlocking type solder connections for alignment and bonding of wafers and/or substrates
Grant 8,928,133 - Baskaran January 6, 2
2015-01-06
Electrolytic process using anion permeable barrier
Grant 8,852,417 - Baskaran , et al. October 7, 2
2014-10-07
Methods For Electrochemical Deposition Of Multi-component Solder Using Cation Permeable Barrier
App 20140246324 - Baskaran; Rajesh ;   et al.
2014-09-04
Electrolytic Process Using Cation Permeable Barrier
App 20140209472 - Baskaran; Rajesh ;   et al.
2014-07-31
Interlocking Type Solder Connections For Alignment And Bonding Of Wafers And/or Substrates
App 20130292037 - Baskaran; Rajesh
2013-11-07
Electrolytic Process Using Cation Permeable Barrier
App 20120292194 - Baskaran; Rajesh ;   et al.
2012-11-22
Electrolytic process using cation permeable barrier
Grant 8,236,159 - Baskaran , et al. August 7, 2
2012-08-07
Electrolytic Copper Process Using Anion Permeable Barrier
App 20120152751 - Baskaran; Rajesh ;   et al.
2012-06-21
Electrolytic copper process using anion permeable barrier
Grant 8,123,926 - Baskaran , et al. February 28, 2
2012-02-28
Method and system for idle state operation
Grant 7,628,898 - Klocke , et al. December 8, 2
2009-12-08
Method For Electrochemically Depositing Metal Onto A Microelectronic Workpiece
App 20080264774 - Baskaran; Rajesh ;   et al.
2008-10-30
Apparatus and Method for Thermally Controlled Processing of Microelectronic Workpieces
App 20080011450 - Hanson; Kyle M. ;   et al.
2008-01-17
Reactors, systems, and methods for electroplating microfeature workpieces
App 20070261964 - Wilson; Gregory J. ;   et al.
2007-11-15
Apparatus and method for thermally controlled processing of microelectronic workpieces
Grant 7,252,714 - Hanson , et al. August 7, 2
2007-08-07
Electrolytic copper process using anion permeable barrier
App 20070068820 - Baskaran; Rajesh ;   et al.
2007-03-29
Copper electrolytic process using cation permeable barrier
App 20060260946 - Baskaran; Rajesh ;   et al.
2006-11-23
Method for applying metal features onto barrier layers using electrochemical deposition
Grant 7,135,404 - Baskaran , et al. November 14, 2
2006-11-14
Electrolytic process using cation permeable barrier
App 20060237323 - Baskaran; Rajesh ;   et al.
2006-10-26
Die-level wafer contact for direct-on-barrier plating
App 20060226019 - Thompson; Raymon F. ;   et al.
2006-10-12
Method for applying metal features onto barrier layers using ion permeable barriers
App 20060189129 - Baskaran; Rajesh ;   et al.
2006-08-24
Electrolytic process using anion permeable barrier
App 20060163072 - Baskaran; Rajesh ;   et al.
2006-07-27
Electrolytic process using anion permeable barrier
App 20060157355 - Baskaran; Rajesh ;   et al.
2006-07-20
Method for applying metal features onto metallized layers using electrochemical deposition and alloy treatment
App 20060084264 - Baskaran; Rajesh ;   et al.
2006-04-20
Method for applying metal features onto metallized layers using electrochemical deposition
App 20060079085 - Baskaran; Rajesh ;   et al.
2006-04-13
Method for applying metal features onto metallized layers using electrochemical deposition using acid treatment
App 20060079083 - Baskaran; Rajesh ;   et al.
2006-04-13
Method for applying metal features onto metallized layers using electrochemical deposition and electrolytic treatment
App 20060079084 - Baskaran; Rajesh ;   et al.
2006-04-13
Method and system for idle state operation
App 20060032758 - Klocke; John ;   et al.
2006-02-16
Method for applying metal features onto barrier layers using electrochemical deposition
App 20040072419 - Baskaran, Rajesh ;   et al.
2004-04-15
Apparatus and method for thermally controlled processing of microelectronic workpieces
App 20040013808 - Hanson, Kyle M. ;   et al.
2004-01-22

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