Bartsch; Christin

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bartsch; Christin.The latest application filed is for "copper interconnect with metal hardmask removal".

Company Profile

0.10.8

Bartsch; Christin - Lauterbach DE
Bartsch; Christin - Stolpen OT N/A DE
Bartsch; Christin - Stolpen N/A DE
Bartsch; Christin - Stolpen OT Lauterbach DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reducing copper defects during a wet chemical cleaning of exposed copper surfaces in a metallization layer of a semiconductor device Grant 8,673,087 - Feustel , et al. March 18, 2	2014-03-18
Copper interconnect with metal hardmask removal Grant 8,664,115 - Bartsch , et al. March 4, 2	2014-03-04
Method and system for quantitative inline material characterization in semiconductor production processes based on structural measurements and related models Grant 8,423,320 - Schaller , et al. April 16, 2	2013-04-16
Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices Grant 8,338,293 - Bartsch , et al. December 25, 2	2012-12-25
Copper Interconnect With Metal Hardmask Removal App 20120315755 - Bartsch; Christin ; et al.	2012-12-13
Method Of Reducing Erosion Of A Metal Cap Layer During Via Patterning In Semiconductor Devices App 20120003832 - Bartsch; Christin ; et al.	2012-01-05
Method of reducing erosion of a metal cap layer during via patterning in semiconductor devices Grant 7,986,040 - Bartsch , et al. July 26, 2	2011-07-26
Method And System For Quantitative Inline Material Characterization In Semiconductor Production Processes Based On Structural Measurements And Related Models App 20090319196 - Schaller; Matthias ; et al.	2009-12-24
Method Of Reducing Erosion Of A Metal Cap Layer During Via Patterning In Semiconductor Devices App 20090273086 - Bartsch; Christin ; et al.	2009-11-05
Reducing Copper Defects During A Wet Chemical Cleaning Of Exposed Copper Surfaces In A Metallization Layer Of A Semiconductor Device App 20090139543 - Feustel; Frank ; et al.	2009-06-04
Method of reducing contamination by removing an interlayer dielectric from the substrate edge Grant 7,410,885 - Schuehrer , et al. August 12, 2	2008-08-12
Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer Grant 7,259,091 - Schuehrer , et al. August 21, 2	2007-08-21
Method Of Reducing Contamination By Removing An Interlayer Dielectric From The Substrate Edge App 20070026670 - Schuehrer; Holger ; et al.	2007-02-01
Method of forming electrical connections in a semiconductor structure App 20060141775 - Schuehrer; Holger ; et al.	2006-06-29
Technique for forming a passivation layer prior to depositing a barrier layer in a copper metallization layer App 20060024951 - Schuehrer; Holger ; et al.	2006-02-02

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