Barth; William K.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Barth; William K..The latest application filed is for "method for improved local planarity control during electropolishing".
- Barth; William K. - Gresham OR
| Patent | Date |
|---|---|
| Dual damascene interconnect structure with improved electro migration lifetimes Grant 7,312,532 - Burke , et al. December 25, 2 | 2007-12-25 |
| Inter-layer interconnection structure for large electrical connections Grant 7,160,805 - Burke , et al. January 9, 2 | 2007-01-09 |
| Dual damascene interconnect structure with improved electro migration lifetimes Grant 7,033,929 - Burke , et al. April 25, 2 | 2006-04-25 |
| Method for creating barrier layers for copper diffusion Grant 6,998,343 - Sun , et al. February 14, 2 | 2006-02-14 |
| Method for improved local planarity control during electropolishing App 20050224358 - Kwak, Byung-Sung ; et al. | 2005-10-13 |
| Dual damascene interconnect structure with improved electro migration lifetimes App 20050186782 - Burke, Peter A. ; et al. | 2005-08-25 |
| Inter-layer interconnection structure for large electrical connections Grant 6,642,597 - Burke , et al. November 4, 2 | 2003-11-04 |
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