Barstad; Leon R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Barstad; Leon R..The latest application filed is for "filling through-holes".
- Barstad; Leon R. - Raynham MA
| Patent | Date |
|---|---|
| Filling through-holes Grant 10,154,598 - Jayaraju , et al. Dec | 2018-12-11 |
| Method of filling through-holes Grant 9,598,787 - Jayaraju , et al. March 21, 2 | 2017-03-21 |
| Method of electroplating uniform copper layers Grant 9,365,943 - Najjar , et al. June 14, 2 | 2016-06-14 |
| Filling Through-holes App 20160105975 - Jayaraju; Nagarajan ; et al. | 2016-04-14 |
| Method Of Filling Through-holes App 20140262801 - JAYARAJU; Nagarajan ; et al. | 2014-09-18 |
| Method Of Filling Through-holes App 20140262799 - JAYARAJU; Nagarajan ; et al. | 2014-09-18 |
| Method Of Electroplating Uniform Copper Layers App 20120318676 - NAJJAR; Elie H. ; et al. | 2012-12-20 |
| Bath analysis Grant 7,384,535 - Sonnenberg , et al. June 10, 2 | 2008-06-10 |
| Electrolytic copper plating solutions App 20060183328 - Barstad; Leon R. ; et al. | 2006-08-17 |
| Analysis method App 20060151327 - Sonnenberg; Wade ; et al. | 2006-07-13 |
| Reverse pulse plating composition and method App 20060081475 - Barstad; Leon R. ; et al. | 2006-04-20 |
| Electrolytic copper plating solutions App 20060065537 - Barstad; Leon R. ; et al. | 2006-03-30 |
| Plating bath and method for depositing a metal layer on a substrate App 20050155866 - Gabe, David R. ; et al. | 2005-07-21 |
| Plating bath and method for depositing a metal layer on a substrate App 20050139118 - Cobley, Andrew J. ; et al. | 2005-06-30 |
| Plating bath and method for depositing a metal layer on a substrate Grant 6,911,068 - Cobley , et al. June 28, 2 | 2005-06-28 |
| Reverse pulse plating composition and method App 20050016858 - Barstad, Leon R. ; et al. | 2005-01-27 |
| Bath analysis App 20050016856 - Sonnenberg, Wade ; et al. | 2005-01-27 |
| Plating bath analysis Grant 6,827,839 - Sonnenberg , et al. December 7, 2 | 2004-12-07 |
| Plating bath and method for depositing a metal layer on a substrate App 20040206631 - Cobley, Andrew J. ; et al. | 2004-10-21 |
| Plating bath and method for depositing a metal layer on a substrate Grant 6,773,573 - Gabe , et al. August 10, 2 | 2004-08-10 |
| Plating bath and method for depositing a metal layer on a substrate App 20040104124 - Cobley, Andrew J. ; et al. | 2004-06-03 |
| Plating bath and method for depositing a metal layer on a substrate Grant 6,736,954 - Cobley , et al. May 18, 2 | 2004-05-18 |
| Plating bath and method for depositing a metal layer on a substrate App 20040074778 - Cobley, Andrew J. ; et al. | 2004-04-22 |
| Plating bath and method for depositing a metal layer on a substrate Grant 6,652,731 - Cobley , et al. November 25, 2 | 2003-11-25 |
| Plating bath and method for depositing a metal layer on a substrate App 20030102226 - Gabe, David R. ; et al. | 2003-06-05 |
| Plating bath and method for depositing a metal layer on a substrate App 20030085132 - Cobley, Andrew J. ; et al. | 2003-05-08 |
| Plating bath and method for depositing a metal layer on a substrate App 20030070934 - Cobley, Andrew J. ; et al. | 2003-04-17 |
| Plating bath and method for depositing a metal layer on a substrate App 20030066756 - Gabe, David R. ; et al. | 2003-04-10 |
| Electrolytic copper plating solutions App 20030010646 - Barstad, Leon R. ; et al. | 2003-01-16 |
| Electrolytic copper plating method Grant 6,444,110 - Barstad , et al. September 3, 2 | 2002-09-03 |
| Plating bath analysis App 20020074244 - Sonnenberg, Wade ; et al. | 2002-06-20 |
| Seed layer repair method App 20020000382 - Morrissey, Denis ; et al. | 2002-01-03 |
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