Barber; Ivor G.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Barber; Ivor G..The latest application filed is for "methods and apparatus for thermal interface material (tim) bond line thickness (blt) reduction and tim adhesion enhancement for efficient thermal management".

Company Profile

3.10.7

Barber; Ivor G. - Los Gatos CA
Barber; Ivor G. - Milpitas CA
Barber; Ivor G. - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Testing system for lid-less integrated circuit packages Grant 10,527,670 - Refai-Ahmed , et al. J	2020-01-07
Methods and apparatus for thermal interface material (TIM) bond line thickness (BLT) reduction and TIM adhesion enhancement for efficient thermal management Grant 10,529,645 - Gandhi , et al. J	2020-01-07
Chip package assembly with enhanced interconnects and method for fabricating the same Grant 10,319,606 - Gandhi , et al.	2019-06-11
Methods And Apparatus For Thermal Interface Material (tim) Bond Line Thickness (blt) Reduction And Tim Adhesion Enhancement For Efficient Thermal Management App 20180358280 - Gandhi; Jaspreet Singh ; et al.	2018-12-13
Method and apparatus for assembling and testing a multi-integrated circuit package Grant 10,096,502 - Refai-Ahmed , et al. October 9, 2	2018-10-09
Testing System For Lid-less Integrated Circuit Packages App 20180284187 - Refai-Ahmed; Gamal ; et al.	2018-10-04
Stacked silicon package assembly having an enhanced lid Grant 10,043,730 - Refai-Ahmed , et al. August 7, 2	2018-08-07
Method And Apparatus For Assembling And Testing A Multi-integrated Circuit Package App 20180144963 - Refai-Ahmed; Gamal ; et al.	2018-05-24
Stacked Silicon Package Assembly Having An Enhanced Lid App 20170092619 - Refai-Ahmed; Gamal ; et al.	2017-03-30
Multi-die Semiconductor Package And Method Of Manufacturing Thereof App 20140191403 - Barber; Ivor G.	2014-07-10
Integrated Circuit System Monitor App 20090285261 - Casey; Michael J. ; et al.	2009-11-19
Via construction for structural support Grant 6,943,446 - McCormick , et al. September 13, 2	2005-09-13
Via construction App 20040089953 - McCormick, John P. ; et al.	2004-05-13
Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill Grant 6,673,708 - Barber , et al. January 6, 2	2004-01-06
Method of packaging integrated circuits Grant 5,801,072 - Barber September 1, 1	1998-09-01
Method of flip chip assembly Grant 5,723,369 - Barber March 3, 1	1998-03-03
Method of packaging an integrated circuit Grant 5,700,723 - Barber December 23, 1	1997-12-23

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