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name:-0.010406017303467
name:-0.0085179805755615
Barber; Ivor Patent Filings

Barber; Ivor

Patent Applications and Registrations

Patent applications and USPTO patent grants for Barber; Ivor.The latest application filed is for "semiconductor chip gettering".

Company Profile
8.10.7
  • Barber; Ivor - Santa Clara CA
  • Barber; Ivor - Los Gatos CA
  • Barber; Ivor - Los Altos CA
  • Barber; Ivor - San Jose CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor chip gettering
Grant 11,393,697 - Agarwal , et al. July 19, 2
2022-07-19
Semiconductor Chip Gettering
App 20210050223 - AGARWAL; RAHUL ;   et al.
2021-02-18
Semiconductor chip gettering
Grant 10,825,692 - Agarwal , et al. November 3, 2
2020-11-03
Semiconductor Chip Gettering
App 20200203177 - Agarwal; Rahul ;   et al.
2020-06-25
Molded chip combination
Grant 10,510,721 - Bhagavat , et al. Dec
2019-12-17
Molded Chip Combination
App 20190051633 - Bhagavat; Milind S. ;   et al.
2019-02-14
Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
Grant 7,829,424 - Miller , et al. November 9, 2
2010-11-09
Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
Grant 7,508,062 - Miller , et al. March 24, 2
2009-03-24
Package Configuration And Manufacturing Method Enabling The Addition Of Decoupling Capacitors To Standard Package Designs
App 20080272863 - MILLER; LEAH ;   et al.
2008-11-06
Integrated circuit package and method having wire-bonded intra-die electrical connections
Grant 7,173,328 - Barber February 6, 2
2007-02-06
Package configuration and manufacturing method enabling the addition of decoupling capacitors to standard package designs
App 20060202303 - Miller; Leah ;   et al.
2006-09-14
Integrated circuit package and method having wire-bonded intra-die electrical connections
App 20050224964 - Barber, Ivor
2005-10-13
Semiconductor device assembly with minimized bond finger connections
Grant 5,895,968 - Barber April 20, 1
1999-04-20
Semiconductor device assembly with minimized bond finger connections
Grant 5,604,161 - Barber February 18, 1
1997-02-18
Semiconductor device assembly with minimized bond finger connections
Grant 5,545,923 - Barber August 13, 1
1996-08-13

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