Baraton; Xavier

Patent Applications and Registrations

Patent applications and USPTO patent grants for Baraton; Xavier.The latest application filed is for "integrated circuit package and method of forming the same".

Company Profile

0.4.6

Baraton; Xavier - Moirans FR
Baraton; Xavier - Singapore N/A SG
Baraton; Xavier - Montrouge FR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated circuit package and method of forming the same Grant 9,455,241 - Jin , et al. September 27, 2	2016-09-27
Integrated Circuit Package And Method Of Forming The Same App 20150303168 - JIN; YONGGANG ; et al.	2015-10-22
Reducing warpage for fan-out wafer level packaging Grant 9,012,269 - Jin , et al. April 21, 2	2015-04-21
Reducing Warpage For Fan-out Wafer Level Packaging App 20120244664 - Jin; Yonggang ; et al.	2012-09-27
Integrated Circuit Package And Method Of Forming The Same App 20100187651 - JIN; Yonggang ; et al.	2010-07-29
Reducing Warpage For Fan-out Wafer Level Packaging App 20100167471 - Jin; Yonggang ; et al.	2010-07-01
Electronic Circuit Assembly, Device Comprising Such Assembly and Method for Fabricating Such Device App 20080253095 - Baraton; Xavier ; et al.	2008-10-16
Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it Grant 7,247,928 - Laurent , et al. July 24, 2	2007-07-24
Semiconductor device with electrical connection balls between an integrated circuit chip and a support plate, and process for fabricating it App 20050017331 - Laurent, Patrick ; et al.	2005-01-27

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