Bao; Zhongping

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bao; Zhongping.The latest application filed is for "structure and method for protecting stress-sensitive integrated circuit".

Company Profile

0.11.13

Bao; Zhongping - San Diego CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Stacked multi-chip integrated circuit package Grant 9,406,649 - He , et al. August 2, 2	2016-08-02
Crack stopping structure in wafer level packaging (WLP) Grant 9,379,065 - Keser , et al. June 28, 2	2016-06-28
DC/ AC dual function Power Delivery Network (PDN) decoupling capacitor Grant 9,263,186 - Li , et al. February 16, 2	2016-02-16
Structure And Method For Protecting Stress-sensitive Integrated Circuit App 20160013136 - RAMACHANDRAN; Vidhya ; et al.	2016-01-14
Interconnect pillars with directed compliance geometry Grant 9,184,144 - Bao , et al. November 10, 2	2015-11-10
Stacked Multi-chip Integrated Circuit Package App 20150155265 - He; Dongming ; et al.	2015-06-04
Stacked multi-chip integrated circuit package Grant 8,963,339 - He , et al. February 24, 2	2015-02-24
Crack Stopping Structure In Wafer Level Packaging (wlp) App 20150048517 - Keser; Lizabeth Ann ; et al.	2015-02-19
Thermal management of integrated circuits using phase change material and heat spreaders Grant 8,937,384 - Bao , et al. January 20, 2	2015-01-20
Non-circular under bump metallization (UBM) structure, orientation of non-circular UBM structure and trace orientation to inhibit peeling and/or cracking Grant 8,847,391 - Bao , et al. September 30, 2	2014-09-30
Dc/ Ac Dual Function Power Delivery Network (pdn) Decoupling Capacitor App 20140252544 - Li; Yue ; et al.	2014-09-11
Stacked Multi-chip Integrated Circuit Package App 20140097535 - He; Dongming ; et al.	2014-04-10
Non-circular Under Bump Metallization (ubm) Structure, Orientation Of Non-circular Ubm Structure And Trace Orientation To Inhibit Peeling And/or Cracking App 20140008788 - Bao; Zhongping ; et al.	2014-01-09
System and method for use case-based thermal analysis of heuristically determined component combinations and layouts in a portable computing device Grant 8,601,428 - Burrell , et al. December 3, 2	2013-12-03
Thermal Management Of Integrated Circuits Using Phase Change Material And Heat Spreaders App 20130285233 - Bao; Zhongping ; et al.	2013-10-31
System and Method For Use Case-Based Thermal Analysis of Heuristically Determined Component Combinations and Layouts In A Portable Computing Device App 20130167103 - Burrell; James D. ; et al.	2013-06-27
Interconnect Pillars with Directed Compliance Geometry App 20130020711 - Bao; Zhongping ; et al.	2013-01-24
Reinforced Wafer-Level Molding to Reduce Warpage App 20120025362 - Chandrasekaran; Arvind ; et al.	2012-02-02

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