loadpatents
name:-0.015874862670898
name:-0.0090718269348145
name:-0.00045609474182129
Bao; Shanquan Patent Filings

Bao; Shanquan

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bao; Shanquan.The latest application filed is for "transparent ring led assembly".

Company Profile
0.8.13
  • Bao; Shanquan - Sunnyvale CA US
  • Bao; Shanquan - Alameda CA
  • Bao; Shanquan - San Ramon CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Multi-cup LED assembly
Grant 9,252,336 - Shi , et al. February 2, 2
2016-02-02
Transparent ring LED assembly
Grant 7,887,384 - Shaikevitch , et al. February 15, 2
2011-02-15
Multi-cup Led Assembly
App 20100079994 - Shi; Wei ;   et al.
2010-04-01
Transparent Ring Led Assembly
App 20100080006 - Shaikevitch; Alex ;   et al.
2010-04-01
Method And Apparatus For Reduction Of External Elastomeric Connector Compression Force
App 20090017649 - Wu; Hongqi ;   et al.
2009-01-15
Connector alignment system for a highly integrated, installable miniaturized form factor card for wireless communications functions
Grant 7,416,417 - Wu , et al. August 26, 2
2008-08-26
Connector for a highly integrated, installable miniaturized form factor card for wireless communications functions
Grant 7,416,450 - Wu , et al. August 26, 2
2008-08-26
External Memories Architecture To Enable Software Partition And Customization For Mobile Terminals With Insertable Communications Cards
App 20080171577 - Huang; William X. ;   et al.
2008-07-17
Method and apparatus for reducing pin count for connection of a miniaturized form factor card in a mobile information device
Grant 7,392,954 - Li , et al. July 1, 2
2008-07-01
Dual Display, Dual Keypad, And Dual Processor Architecture For Power Conservation For Wireless Terminals
App 20080153452 - Huang; William X. ;   et al.
2008-06-26
Method And Apparatus For Reducing Pin Count For Connection Of A Miniaturized Form Factor Card In A Mobile Information Device
App 20080121685 - Le; Taojin ;   et al.
2008-05-29
Method and apparatus for soldering option of a highly integrated miniaturized form factor card
Grant 7,361,057 - Bao , et al. April 22, 2
2008-04-22
Heat dissipation system for a miniaturized form factor communications card
Grant 7,333,339 - Liu , et al. February 19, 2
2008-02-19
Method and Apparatus for Routing Content for a Mobile Phone Over an Alternative Wireless Network
App 20070259687 - Huang; William X. ;   et al.
2007-11-08
Single Elastomeric Connector System To Support Rf, Digital, Audio And Dc Signals
App 20070254503 - Bao; Shanquan ;   et al.
2007-11-01
Heat Dissipation System For A Miniaturized Form Factor Communications Card
App 20070247815 - Liu; Guo Tao ;   et al.
2007-10-25
Connector Alignment System For A Highly Integrated, Installable Miniaturized Form Factor Card For Wireless Communications Functions
App 20070238325 - Wu; Hongqi ;   et al.
2007-10-11
Connector For A Highly Integrated, Installable Miniaturized Form Factor Card For Wireless Communications Functions
App 20070238363 - Wu; Hongqi ;   et al.
2007-10-11
Miniaturized Form Factor Wireless Communications Card For Generic Mobile Information Devices
App 20070103876 - Huang; William X. ;   et al.
2007-05-10
METHOD AND APPARATUS FOR WiFi TERMINAL WITH DUAL MAC STRUCTURE THAT ENABLES SEAMLESS VOICE COMMUNICATIONS HANDOVER
App 20060268799 - Huang; William X. ;   et al.
2006-11-30

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