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Patent applications and USPTO patent grants for Bao; Lihua.The latest application filed is for "vacuum switching apparatus, and electrode extension assembly and associated assembly method therefor".
Patent | Date |
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Vacuum switching apparatus, and electrode extension assembly and associated assembly method therefor Grant 9,330,867 - Leusenkamp , et al. May 3, 2 | 2016-05-03 |
Vacuum Switching Apparatus, And Electrode Extension Assembly And Associated Assembly Method Therefor App 20150332879 - Leusenkamp; Martin B.J. ;   et al. | 2015-11-19 |
Contact System App 20140094041 - Chen; Qingqi ;   et al. | 2014-04-03 |
Method of Avoiding Resin Outflow from the Wafer Scribe line in WLCSP App 20120142165 - Huang; Ping ;   et al. | 2012-06-07 |
Semiconductor Package Process With Improved Die Attach Method For Ultrathin Chips App 20110294262 - Huang; Ping ;   et al. | 2011-12-01 |
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