Bansal; Raj K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bansal; Raj K..The latest application filed is for "semiconductor assemblies with hybrid fanouts and associated methods and systems".

Company Profile

1.7.9

Bansal; Raj K. - Taichung TW
Bansal; Raj K. - Boise ID
Bansal; Raj K. - Taichung City TW
Bansal; Raj K. - Xitun Dist. Taichung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming the same Grant 11,456,253 - Sugioka , et al. September 27, 2	2022-09-27
Semiconductor assemblies with hybrid fanouts and associated methods and systems Grant 11,450,645 - Bhushan , et al. September 20, 2	2022-09-20
Semiconductor Assemblies With Hybrid Fanouts And Associated Methods And Systems App 20220165708 - Bhushan; Bharat ; et al.	2022-05-26
Bond Pad Connection Layout App 20220165701 - Bhushan; Bharat ; et al.	2022-05-26
Integrated circuit structures and methods of forming an opening in a material Grant 11,211,347 - Sugioka , et al. December 28, 2	2021-12-28
Semiconductor Device And Method Of Forming The Same App 20210351133 - Sugioka; Shigeru ; et al.	2021-11-11
Stacked Die Package Including A First Die Coupled To A Substrate Through Direct Chip Attachment And A Second Die Coupled To The Substrate Through Wire Bonding, And Related Methods, Devices And Apparatuses App 20210327856 - Fujisawa; Hiroki ; et al.	2021-10-21
Stacked die package including a first die coupled to a substrate through direct chip attachment and a second die coupled to the substrate through wire bonding and related methods, devices and apparatuses Grant 11,081,468 - Fujisawa , et al. August 3, 2	2021-08-03
Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrate Grant 10,943,841 - Sugioka , et al. March 9, 2	2021-03-09
Stacked Die Package Including Wire Bonding And Direct Chip Attachment, And Related Methods, Devices And Apparatuses App 20210066247 - Fujisawa; Hiroki ; et al.	2021-03-04
Integrated Circuit Structures And Methods Of Forming An Opening In A Material App 20210020592 - Sugioka; Shigeru ; et al.	2021-01-21
Integrated circuit structures and methods of forming an opening in a material Grant 10,847,482 - Sugioka , et al. November 24, 2	2020-11-24
Substrates, Structures Within A Scribe-Line Area Of A Substrate, And Methods Of Forming A Conductive Line Of A Redistribution La App 20200227327 - Sugioka; Shigeru ; et al.	2020-07-16
Substrates, structures within a scribe-line area of a substrate, and methods of forming a conductive line of a redistribution layer of a substrate and of forming a structure within a scribe-line area of the substrate Grant 10,651,100 - Sugioka , et al.	2020-05-12
Substrates, Structures Within A Scribe-Line Area Of A Substrate, And Methods Of Forming A Conductive Line Of A Redistribution La App 20190355631 - Sugioka; Shigeru ; et al.	2019-11-21
Integrated Circuit Structures And Methods Of Forming An Opening In A Material App 20190355682 - Sugioka; Shigeru ; et al.	2019-11-21

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