Banks, Donald R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Banks, Donald R..The latest application filed is for "crack resistant interconnect module".
- Banks, Donald R. - Eau Claire WI
- Banks; Donald R. - Pflugerville TX
| Patent | Date |
|---|---|
| Crack resistant interconnect module App 20040104463 - Gorrell, Robin E. ; et al. | 2004-06-03 |
| Method for assembling an integrated circuit chip package having an underfill material between a chip and a substrate Grant 6,015,722 - Banks , et al. January 18, 2 | 2000-01-18 |
| Method for assembling an integrated circuit chip package having at least one semiconductor device Grant 5,970,319 - Banks , et al. October 19, 1 | 1999-10-19 |
| Method for assembling an integrated circuit chip package having at least one semiconductor device Grant 5,919,329 - Banks , et al. July 6, 1 | 1999-07-06 |
| Solder ball interconnected assembly Grant 5,591,941 - Acocella , et al. January 7, 1 | 1997-01-07 |
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