BANG; YONG-SEUNG
Patent Applications and Registrations
Patent applications and USPTO patent grants for BANG; YONG-SEUNG.The latest application filed is for "chip to package interaction test vehicle and method for testing chip to package interaction using the same".
- BANG; YONG-SEUNG - SEOUL KR
| Patent | Date |
|---|---|
| Chip To Package Interaction Test Vehicle And Method For Testing Chip To Package Interaction Using The Same App 20150253374 - LEE; SANG-MAN ; et al. | 2015-09-10 |
| Array variable capacitor apparatus Grant 8,040,656 - Park , et al. October 18, 2 | 2011-10-18 |
| Array Variable Capacitor Apparatus App 20090185325 - PARK; Yun-kwon ; et al. | 2009-07-23 |
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