Bang; Hyo-jae

Patent Applications and Registrations

Patent applications and USPTO patent grants for Bang; Hyo-jae.The latest application filed is for "super capacitor casing and supercapacitor embedded device".

Company Profile

0.27.28

Bang; Hyo-jae - Hwaseong-si KR
Bang; Hyo-Jae - Hwasung-si N/A KR
Bang; Hyo-Jae - Cheonan-si N/A KR
Bang; Hyo-Jae - Chungcheongnam-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Memory device Grant D795,261 - Bang , et al. August 22, 2	2017-08-22
Memory device Grant D795,262 - Bang , et al. August 22, 2	2017-08-22
Memory device Grant D794,643 - Bang , et al. August 15, 2	2017-08-15
Memory device Grant D794,641 - Bang , et al. August 15, 2	2017-08-15
Memory device Grant D794,642 - Bang , et al. August 15, 2	2017-08-15
Memory device Grant D794,644 - Bang , et al. August 15, 2	2017-08-15
Memory device Grant D794,034 - Bang , et al. August 8, 2	2017-08-08
Data storage devices including multiple host interfaces and user devices including the same Grant 9,208,068 - Bang , et al. December 8, 2	2015-12-08
Device including circuit board with different form factor terminal sets and assemblies including the same Grant 8,982,567 - Bang , et al. March 17, 2	2015-03-17
Super capacitor casing and supercapacitor embedded device Grant 8,934,255 - Bang , et al. January 13, 2	2015-01-13
Super Capacitor Casing And Supercapacitor Embedded Device App 20140160660 - BANG; Hyo-Jae ; et al.	2014-06-12
Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same App 20130077270 - BANG; Hyo-Jae ; et al.	2013-03-28
Pressure conductive sheet Grant 8,385,079 - Choi , et al. February 26, 2	2013-02-26
Super capacitor casing and supercapacitor embedded device Grant 8,339,794 - Bang , et al. December 25, 2	2012-12-25
Fin-type heat sink for electronic component Grant 8,240,360 - Bang , et al. August 14, 2	2012-08-14
Reworkable passive element embedded printed circuit board Grant 8,218,330 - Bang , et al. July 10, 2	2012-07-10
Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly Grant 8,189,342 - Bang , et al. May 29, 2	2012-05-29
Semiconductor Memory Module With Reverse Mounted Chip Resistor App 20110256671 - CHOI; Hyun-Seok ; et al.	2011-10-20
Semiconductor memory module with reverse mounted chip resistor Grant 7,990,734 - Choi , et al. August 2, 2	2011-08-02
Memory modules and systems including the same Grant 7,968,994 - Bang June 28, 2	2011-06-28
Semiconductor device and method of manufacturing the same Grant 7,906,423 - Bang , et al. March 15, 2	2011-03-15
Semiconductor package having passive component and semiconductor memory module including the same Grant 7,902,664 - Bang , et al. March 8, 2	2011-03-08
Method of fabricating an electronic device Grant 7,900,349 - Han , et al. March 8, 2	2011-03-08
Super Capacitor Casing And Supercapacitor Embedded Device App 20100232124 - BANG; Hyo-Jae ; et al.	2010-09-16
Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same Grant 7,791,178 - Bang , et al. September 7, 2	2010-09-07
Pressure Conductive Sheet App 20100149776 - CHOI; Jae-Hoon ; et al.	2010-06-17
Stacked semiconductor module, method of fabricating the same, and electronic system using the same Grant 7,715,200 - Cho , et al. May 11, 2	2010-05-11
Semiconductor Device And Method Of Manufacturing The Same App 20100105201 - Bang; Hyo-Jae ; et al.	2010-04-29
Semiconductor device and method of manufacturing the same Grant 7,663,219 - Bang , et al. February 16, 2	2010-02-16
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same Grant 7,576,437 - Han , et al. August 18, 2	2009-08-18
Stacked semiconductor module, method of fabricating the same, and electronic system using the same App 20090129041 - Cho; Jung-Chan ; et al.	2009-05-21
Semiconductor module with conductive element between chip packages Grant 7,521,788 - Bang , et al. April 21, 2	2009-04-21
Fin-type Heat Sink For Electronic Component App 20090065175 - BANG; Hyo-Jae ; et al.	2009-03-12
Semiconductor Module App 20090016022 - HAN; Hun ; et al.	2009-01-15
Printed Circuit Board Capable Of Void Control During Surface Mounting Process App 20080164054 - SHIN; Dong-Woo ; et al.	2008-07-10
Chip Network Resistor Contacting Pcb Through Solder Balls And Semiconductor Module Having The Same App 20080136580 - BANG; Hyo-Jae ; et al.	2008-06-12
Electronic Device With Reworkable Electronic Component, Method Of Fabricating The Electronic Device And Method Of Reworking The Electronic Component App 20080130254 - HAN; Seong-Chan ; et al.	2008-06-05
Lead frame unit, semiconductor package having a lead frame unit, stacked semiconductor package having a semiconductor package and methods of manufacturing the same App 20080116546 - Bang; Hyo-Jae ; et al.	2008-05-22
Semiconductor device and method of manufacturing the same App 20080111235 - Bang; Hyo-Jae ; et al.	2008-05-15
Semiconductor Memory Module With Reverse Mounted Chip Resistor App 20080106876 - CHOI; Hyun-Seok ; et al.	2008-05-08
Lead Frame Type Stack Package And Method O Fabricating The Same App 20080079128 - BANG; Hyo-Jae ; et al.	2008-04-03
Reworkable Passive Element Embedded Printed Circuit Board App 20080079118 - BANG; Hyo-jae ; et al.	2008-04-03
Mounting Structure Of Semiconductor Device Having Flux And Under Fill Resin Layer And Method Of Mounting Semiconductor Device App 20080042279 - BANG; Hyo-Jae ; et al.	2008-02-21
Semiconductor package and method of manufacturing the same App 20080044951 - Bang; Hyo-jae ; et al.	2008-02-21
Semiconductor package having passive component and semiconductor memory module including the same App 20080023812 - Bang; Hyo-jae ; et al.	2008-01-31
Printed circuit board including reinforced copper plated film and method of fabricating the same App 20070181993 - Choi; Jae-Hoon ; et al.	2007-08-09
Printed circuit board of semiconductor package and method for mounting semiconductor package using the same App 20070109758 - Han; Seong-Chan ; et al.	2007-05-17
Method of testing a substrate and apparatus for performing the same App 20070072467 - Lee; Young-Soo ; et al.	2007-03-29
Printed circuit board for memory module, method of manufacturing the same and memory module/socket assembly App 20070047377 - Bang; Hyo-Jae ; et al.	2007-03-01
Semiconductor module and method of manufacturing the same App 20060102997 - Bang; Hyo-Jae ; et al.	2006-05-18
Semiconductor device having heat sink App 20060043578 - Bang; Hyo-Jae ; et al.	2006-03-02

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